Do you have 3D STEP model for AFT05MP075GNR1 which is a TO-270, 4 Lead, Gull Wing (SOT1736-2) package?
1. We don't have any 3D CAD model for the SOT1736-2 package. NXP provides standard set of documents for each product. Unfortunately, it does not include 3D CAD models as "must be".
2. The AN1907 contains basic guidance for footprint design in accordance to IPC_7351 Generic Requirements for SMD and Land Pattern Standard.
https://www.nxp.com/docs/en/application-note/AN1907.pdf
Unfortunately, I haven't got a document with recommended footprint for SOT1736-2 but you can use the following layout:
Heat via farm 300x720 mils. Thermal via count and diameter are the subject to check during thermal design.
RF pads 50x190 mils, outside dimensions 460 mils (minimum SMD pads).
Related documents:
https://www.nxp.com/docs/en/application-note/AN4005.pdf
https://www.nxp.com/docs/en/application-note/AN1949.pdf
Have a great day,
Pavel
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