We use QorlQ devices in our design (LS1020 and T1040). We want to use boundary scan testing after production assembly on smt line. Can we manage thermal levels of this devices when we apply power to boards to do boundary scan? Our development team give me (test eingineer) prototype of the board, but it heats up when i power it, even if it doesn't have any configuration and working program on it. After technological tests before functional control we attache heatsink to board, but it is not so comfortable to do it before boundary scan, espeacially if we need to do repair steps.