I would like to confirm manufacturing method of SABRE-AI and SDB boards.
I guess these boards made by build-up method. Is it right?
Hello Kazuma Sasaki,
While it’s not mentioned on the documentation both the SABRE-SDB and the SABRE-AI boards don’t use build-up vias as they make the manufacture more costly and not all manufacturers can do build-up vidas. They both use through-hole.
I hope this information helps,
I think the SBD boards are through-hole and not build-up, but let me confirm for the SDB and also SABRE-AI and I’ll let you know.
I appreciate your support. I've checked both gerber data.
I believe both boards are build by through-hole method. because, all vias located on same position at all layer.
But, I could not find any comments into any documents.
Thank you for your answer. I understood clearly.
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