Customer ask about chip force limit on the i.MX6 Quad/Dual die itself when the heat-sink/thermal pad is torqued down?
I found NXP AN4871 documents about Assembly Handling and Thermal Solutions for Lidless FCBGA.
i.MX6 Dual/Quad are 21x21mm package, but below table 5 doesn’t have 21x21mm body size info.
Could you help check and provide it?
Thanks a lot,