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i.MX6 Quad/Dual chip force limit

Question asked by Andy Chien on Jul 4, 2018
Latest reply on Jul 5, 2018 by igorpadykov

Dear Sir,


Customer ask about chip force limit  on the i.MX6 Quad/Dual die itself when the heat-sink/thermal pad is torqued down?

 I found NXP AN4871 documents about Assembly Handling and Thermal Solutions for Lidless FCBGA.

i.MX6 Dual/Quad are 21x21mm package, but below table 5 doesn’t have 21x21mm body size info.

Could you help check and provide it?

Thanks a lot,


doesn’t have 21x21mm body size info.