BFR93AW上机偏移和部分虚焊现象

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BFR93AW上机偏移和部分虚焊现象

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venushou
Contributor I

BFR93AW在过回流炉贴片时,发生上机偏移和部分虚焊现象。这是什么原因?

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LPP
NXP Employee
NXP Employee

Please, write your questions in English. Otherwise, we can only understand you using Google translator and may misunderstand you or lose some important details.

BFR93AW is provided in surface mount SOT323 package. You can find recommended reflow soldering profile at this link: SOT323 

Also, refer to surface mount reflow soldering application note:

https://www.nxp.com/docs/en/application-note/AN10365.pdf 


Have a great day,
Pavel

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venushou
Contributor I

Hi Pavel,

Could you please provide your feedback to me?

Best regards,

Venus

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venushou
Contributor I

Triode BFR93AW, our factory found in the mounting process: after SMT welding, we detected that it has a very obvious displacement and the offset is large.

I wonder if this triode has special requirements for printed solder pastes during soldering. Is there any special requirement for setting the temperature 

profile of the reflow oven?

 

Our temperature curve is set as follows:

Upper temperature zone set at (°C): 130 140 150 160 180 210 240 280

Lower temperature zone set at (°C): 130 140 150 160 180 210 240 280

Chain transmission speed: 75CM/MIN

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