Is there any information available from NXP regarding the maximum pressure that can be applied to an IMX6 PoP BGA without damaging the package?
This question is very similar to answered question "IMX6 FCPBGA thermal interface pad". However, I am concerned specifically about the Package-On-Package configuration which I suspect has different maximum pressure specifications.
I am designing a product that has an IMX6 processor in a PoP package. The main PCB is mounted in an aluminum enclosure, which I would also like to use as a heatsink for the IMX6.
A thermal gap pad is placed between the enclosure and the IMX6 for optimal heat transfer. The pad is kept in place by the pressure of the case on the PCB. I have mechanical information about the pad (hardness, thickness, Young's Modulus), but I don't know how much pressure can be applied on the PoP package.