Hi,
There is an application note that may help, it is not specifically designed for the TDA8954, but for other Class-D audio amplifiers from the NXP portfolio, however, this document mention in section 3.9 some recommendation and techniques for the layout design and thermal considerations that can also be used for the TDA8954.
You can find this application note in the following link: www.nxp.com/documents/application_note/AN10436.pdf
Please make sure that the external heatsink is properly calculated according to the requirements mentioned in section 14.5 of the TDA8954 datasheet: http://www.nxp.com/documents/data_sheet/TDA8954.pdf
As extra recommendations:
Use a HF decoupling capacitor of about 100nF .. 220nF nearby the de between each Vp and power ground pin.
When for the HF decoupling capacitors SMD components are used, be aware differences in behavior according to the capacitor material. Good results are found with NPO capacitors which have a low ESR, next are X7R capacitors and last are Y5V capacitors which have a considerable ESR.
Have a great day,
Jose
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