i.MX6SoloX 14 x 14 mm package decoupling

[johnkell]

In Sec. 3.2.1 of the HW Dev Guide for i.MX6SoloX (IMX6SXHDG), it says "A preferred BGA power decoupling design for the layout is available through www.freescale.com. Customers should use the Freescale design strategy for power and decoupling."

I've not been able to find this design information. Any help that could be provided would be appreciated!

We are using the 14 x 14 mm, 400 ball package with an 0.65 mm pitch, as opposed to the i.MX6SoloX Sabre board that uses the 19 x 19 mm, 529 ball package with an 0.8 mm pitch.

[johnkell]

Thanks, Yuri!

Best Regards,

John

[Yuri · Accepted solution]

Hello

  The HW Dev Guide provides recommendations regarding power decoupling design.

As for 14 x 14 mm, 400 ball package with an 0.65 mm pitch layout example, sorry - we

do not have it.

Have a great day,
Yuri

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