We are using a NXP processor, LPC3250 in one of our products. We are facing few difficulties during production stage.
Problem: We have designed our product to work over temperature from -40 to +70 deg C. During production, few of the boards are not coming up (getting hung) when powered at negative temperature (between -20 to-40 deg C). We are booting LPC3250 using a Flash memory and runtime code is accessed from mDDR memory. The part number of Flash is S29GL128S11DHIV20 from Spansion and the part number of mobile-DDR is IS43LR16800F-6BLI from ISSI. We have incorporated all the recommendations in the Errata sheet of LPC3250. I am attaching a report on the tests done here to debug this issue.