I am trying to use a device in my design that is produced in SOT1174-1 package.
For that device I try to design a landpattern.
When I look for the Landpattern documentation, I end up in the footprint information, that is competly not understandable for me.
The measurements of the package are there with 2x2.3CU. CU is nowhere refered to. What does that mean? When I look for the Package outlines I see that the Package should be 2.0x1.7mm.
Many things are dimensioned with that CU parameter.
It would really be nice if I could get information about the Landpattern to give me the ability to create a Footprint that is matching my device later.