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P2020 Processor TEPBGA2 Package Construction

Question asked by ethan135 on Aug 17, 2016
Latest reply on Aug 17, 2016 by andrei.skok

Xilinx's App note XAPP426 indicates they intentionally design in vents between the package's heatspreader (lid) and the organic substrate. Does the P2020 Processor also have these vents designed into its TEPBGA2 package, or is the lid hermetically sealed with the substrate?