DDR_Stress_Tester_V1.0.3 RUN FAILD

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DDR_Stress_Tester_V1.0.3 RUN FAILD

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Harris
Contributor III

Dears:

We had designed a custom board based on iMX6-sdb

IMX6Q5EYM10AD  We have using 4 parts DDR3 1GB   4pcs

Hynix H5TQ2G63GFR-RD。

DDR_Stress_Tester_v1.0.3  test  3pcs board ,   result is below.

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please tell me the result is which  is wrong .and i need do 。

or tell me data was means what?

pattern was what?

source  is wrong means ?

and address of source failure is what ?

Thank you very much.

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igorpadykov
NXP Employee
NXP Employee

Hi Harris

from log memory test writes to address 0x11000000 all "1" but reads

back "0" on some pads, like E9CFFFFF e.t.c. One can attach jtag

debugger and manually write/read to that address data, checking waveforms

with oscilloscope. Changing drive strength on these pads may help.

Varying temperature is one method to narrow down the root cause

- If cooling down the part causes more failures, then it is likely the drive strength

is too high causing more overshoots and undershoots

- If heating up the part causes more failures, then the drive strength is too low and

the signals may not rise/fall fast enough

Best regards

igor

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