Dears:
We had designed a custom board based on iMX6-sdb
IMX6Q5EYM10AD We have using 4 parts DDR3 1GB 4pcs
Hynix H5TQ2G63GFR-RD。
DDR_Stress_Tester_v1.0.3 test 3pcs board , result is below.
please tell me the result is which is wrong .and i need do 。
or tell me data was means what?
pattern was what?
source is wrong means ?
and address of source failure is what ?
Thank you very much.
Hi Harris
from log memory test writes to address 0x11000000 all "1" but reads
back "0" on some pads, like E9CFFFFF e.t.c. One can attach jtag
debugger and manually write/read to that address data, checking waveforms
with oscilloscope. Changing drive strength on these pads may help.
Varying temperature is one method to narrow down the root cause
- If cooling down the part causes more failures, then it is likely the drive strength
is too high causing more overshoots and undershoots
- If heating up the part causes more failures, then the drive strength is too low and
the signals may not rise/fall fast enough
Best regards
igor
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