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Request From NXP microcontroller Designer/Planer team : "Application processor/Fpga multi DSP " repalcement design

Discussion created by lpcware Employee on Jun 15, 2016
Latest reply on Jun 15, 2016 by lpcware
Content originally posted in LPCWare by ganigangi on Fri Oct 25 04:54:05 MST 2013
Hi,

I have already worked on LPC1768

and my program codes was grown till all 512KB of flash was filled
in between because of small 32k+32k bytes of SRAM I was challenging for each code pieces addition
and gradually I encountered the speed limitation ( 100MHZ )

then I planned to migrate to LPC1788 , but it has the same limitation ( 96KB RAM , 120MHZ speed )

I was around to select CM4 such as LPC43xx , but the limitations are the same

flash = 512KB , 1024KB
RAM = 136KB

for my future developments I need

- more than or equal to 2048 KB of FLASH code memory ( 3072MB+ is the best for me )
- more than 256 KB of RAM memory ( 512KB+ is the best for me )

NXP forces me to use flashless CM4 that has more RAM ( 168KB , 200KB , 264KB )
but it should be add external memory and more pcb area

I am confused!

I think there will be a fast growing demand for massive computing power and more larger memory in near future

it is good idea to :

- adding external memory on the top of chip ( 256MB , 512MB , 1024MB SDRAM DDRn )

- increasing core speed to 600MHZ ... 1200MHZ

- adding more cores and dedicated RAM for each core (16...256 cores , 32kB for each ) ( from massive FPGA world )

- adding more I/O pins ( 100 ... 1500 pins ) ( from massive FPGA world )

- adding LVDS IO transeciver logic ( from massive FPGA world )

- increasing ethernet speed to 1000

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these devices will be massively used in automotive ( 1 ... 5 parts per NEW CAR ) on 2015 and next
( where I and my team and competitors are hardly working on projects that based on massive FPGA but expensive )

and for PLC for Industrial

and on IMAGING for MRI_ULTRASOUND

and for military or industrial RADAR

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..........

and it would be great that the chip designers to add hardware's to handle RTOS operations and remove
the " time consuming software overhead" of it

as :
- adding a huge amount of banked registers ( eg: 64 banks of 64word(4bytes) register bank for 64 individual tasks = 64*64*4= 16KBYTES )
( removing the PUSH POP or save and restore on each task

- dedicated RTOS tik timer and a "time plan file" ( a 64 * 2bytes register to define each task "time share" ) + 64*1bytes for priority

- and a connection matrix bus between cores to improve access speed

- and more functional DMA controller to remove any overhead from CPU

it is a large design ......
but the first vendor that will generate this device
will have the huge market share of $10Billion yearly

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[color=#093]
really I need ALL_IN_ONE  solution indeed[/color]


think it:  why should we ( designers )  have to gather too many parts on PCB and route and check and verify and redesign and repeat....

why there isn't  a enough [color=#63f]" total solution in small packages "[/color] ( like DS1643 RTC_NVRAM ) or ( AD_POWER MODULE )

to help us to jump to final design

hmmmm???

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[color=#33f]I hope someone from semiconductor vendors , to monitor this forum and
provide these solutions for all customer around the world[/color]

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[color=#33c]
it should be named  "Field Programmable Core Array" = FPCA  or something[/color]


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