Can anybody provide the Max stress of the IC that could withstand and the Max weight the IC could withstand ?
Please, refer to AN4259 Section 27.2 Thermal Management for WB-TePBGA
"The heat sink should be attached to the printed-circuit board with the spring force centered over the center of the package. This spring force should not exceed 10 pounds of force (45 Newton)."
Retrieving data ...