Applying a MPXV7002 in a high g environment. Looking for a shock spec as an indicator to g force tolerance.
NXP has established semiconductor sensor reliability testing based on exercising to detect failures by the presence of the environmental stress. Potential failure modes and causes are developed by allowing tests to run beyond the normal test times, thus stressing to destruction. One of the typical reliability test matrix used to insure conformance to customers end usage is Mechanical Shock.
This is an environmental test where the sensor device is evaluated to determine its ability to withstand a sudden change in mechanical stress due to an abrupt change in motion. This test simulates motion that may be seen in handling, shipping or actual use. MIL STD 750, Method 2016 Reference.
You may find more information about these reliability tests at:
NXP Sensors - Device Data
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