I am running DDR_Stress_test for my customized board and eventually i got some doubts, Please clarify.
Tool - DDR_Stress_Tester_V1.0.0, Processor - i.MX6 Quadcore, DDR Frequency - 528 MHz, ARM core speed - 800MHz, DDR density - 2GBytes (4GB), Write leveling calibration - 0042
Mode - HID mode is used.
1). Why is the DDR_Stress_test is very slow? each loop is taking approx. 5 minutes.
2). What difference it makes when case i). DDR start Frequency = end frequency and case ii). DDR start & end frequencies are different?
3). How many loops are recommended with case i and case ii (from question 2)? if not both cases, which case is highly recommended?
4). Why to repeat test with updated MMDC register values from calibration? & How many times shall I repeat this test(with calibrated values from previous test) to get final working reg. values?
5). Where can i find exact technical document to know in detail about DDR Stress Test? (I already have user and application guides from FS, like to know reason behind this test)
Please help, Thank you