The datasheet doesn't appear to address the question of how to handle the exposed center pad of the QFN packages for the KL03 MCUs. Ground it? Leave it floating?
I think that the Application Note AN1902 is what you are looking for. It has relevant information regarding hardware considerations for the QFN packages. Please take a look specially in the section 4.2.2 Thermal/Electrical Pad Guidelines.
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yes the exposed center pad has to be grounded.
Thank you! Is this documented some place, and I just missed it?
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