hi I.mx6 community
my ddr calibration and stress test both are failed
how to solve that ?
can any one give me the exact procedure how to do that if i am doing wrong .
go 0x907000
## Starting application at 0x00907000 ...
============================================
DDR Stress Test (2.3.0)
Build: Nov 20 2015, 16:05:41
Freescale Semiconductor, Inc.
============================================
============================================
Chip ID
CHIP ID = i.MX6 Solo/DualLite (0x61)
Internal Revision = TO1.2
============================================
============================================
Boot Configuration
SRC_SBMR1(0x020d8004) = 0x02008000
SRC_SBMR2(0x020d801c) = 0x3a000001
============================================
What ARM core speed would you like to run?
Type 1 for 800MHz, 2 for 1GHz
ARM Clock set to 800MHz
============================================
DDR configuration
BOOT_CFG3[5-4]: 0x00, Single DDR channel.
DDR type is DDR3
Data width: 64, bank num: 8
Row size: 15, col size: 10
Chip select CSD0 is used
Density per chip select: 2048MB
============================================
Current Tempareture: 33
============================================
Please select the DDR density per chip select (in bytes) on the board
Type 0 for 2GB; 1 for 1GB; 2 for 512MB; 3 for 256MB; 4 for 128MB; 5 for 64MB; 6 for 32MB
For maximum supported density (4GB), we can only access up to 3.75GB. Type 7 to select this
DDR density selected (MB): 2048
Would do you want run DDR Calibration? Type 'y' to run and 'n' to skip
Calibration will run at DDR frequency 400MHz. Type 'y' to continue.
If you want to run at other DDR frequency. Type 'n'
Please enter the MR1 value on the initilization script
This will be re-programmed into MR1 after write leveling calibration
Enter as a 4-digit HEX value, example 0004, then hit enter
0000DDR Freq: 396 MHz
ddr_mr1=0x00000000
Start write leveling calibration...
running Write level HW calibration
Write leveling calibration completed, update the following registers in your initialization script
MMDC_MPWLDECTRL0 ch0 (0x021b080c) = 0x0049004F
MMDC_MPWLDECTRL1 ch0 (0x021b0810) = 0x004B004F
MMDC_MPWLDECTRL0 ch1 (0x021b480c) = 0x00670067
MMDC_MPWLDECTRL1 ch1 (0x021b4810) = 0x00620105
Write DQS delay result:
Write DQS0 delay: 79/256 CK
Write DQS1 delay: 73/256 CK
Write DQS2 delay: 79/256 CK
Write DQS3 delay: 75/256 CK
Write DQS4 delay: 103/256 CK
Write DQS5 delay: 103/256 CK
Write DQS6 delay: 133/256 CK
Write DQS7 delay: 98/256 CK
Starting DQS gating calibration
. . . . . . . . . . . . . . ERROR FOUND, we can't get suitable value !!!!
dram test fails for all values.
Error: failed during ddr calibration
###########################################
my test is failed even though SI analysis for DDR is cleared
i am following this procedure
1.i am able to download u-boot through ARM DS-5 with init script from Sabresd board.
2.in u-boot i am downloading ddr-test-uboot-jtag-mx6dl.bin file to 0x907000 and ruuning
3.test failed as i shown above
how to solve this ?
thanks and regards
Saida
Hi Saida
pelase enter meaningful MR1 value (from your log:
"ddr_mr1=0x00000000"), as described on below link
https://community.freescale.com/docs/DOC-96412
Error " "DQS gating calibration. . . . . . . . . . . . . . ERROR FOUND, we can't get suitable value"
can be ignored if all other tests passed.
Best regards
igor
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Hi igorpadykov
i am entering MR1 value 0x0004
1.today my ddr stress test passed upto 226 Mhz than after it fails, what could be the problem for other frequencies after 226Mhz
2. but calibration test is not passed even at 350Mhz
what is the solution to these problems ?
thanks and regards
Saida
>1.today my ddr stress test passed upto 226 Mhz than after it fails, what
>could be the problem for other frequencies after 226Mhz
this may be caused by not good board routing and overall board noise.
Please recheck power supplies filtering and ddr routing guidelines in
i.MX6 System Development User’s Guide (rev.1, 6/2013)
http://cache.freescale.com/files/32bit/doc/user_guide/IMX6DQ6SDLHDG.pdf
~igor
Hi igorpadykov
in my custom board DDR3(2GB) is routed by fly-by-topology and only single clock is used.
is it necessary to connect both the clocks or one clock is sufficient.
if two clocks are necessary,it may be the reason to fail my board stress test ?
Regards
Saida
Hi Saida
it does not matter as DDR_SDCLK0 and DDR_SDCLK1 are
the same. Just for test one can try to hand solder 22uF capacitors
directly under center of chip. Another option is to
software Increase voltages of ARM_CAP, SOC_CAP, PU_CAP.
Best regards
igor
hi
in my board there are some signal conditioning termination resistors which are connected to DDRVREFF instead of VTTR
this may be the problem to fail DDR test.
regards
Saida