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LS1021A - Any plans for a lidded package

Question asked by Nikhil Rao on Nov 26, 2015
Latest reply on Nov 30, 2015 by andrei.skok

Are there any plans for releasing the LS1021A in a lidded package, for use in an automative or outdoor industrial environment?


We have a robust passive heat sink solution worked out for use with the LS1021A's 525-pin FC-PBGA lidless package.  However we have concerns about moisture ingress and possible damage this may cause to a processor in lidless form.  Normally we conformally coat all our circuit boards (PCBAs) before mounting them in their enclosures or in certain cases completely seal the modules (housing the circuit boards) to IP65 rating.