I am designing a product that has an IMX6 processor in an FCPBGA package. The main PCB is mounted in an aluminum enclosure, which I would also like to use as a heatsink for the IMX6.
A thermal gap pad is placed between the enclosure and the IMX6 for optimal heat transfer. The pad is kept in place by the pressure of the case on the PCB. I have mechanical information about the pad (hardness, thickness, Young's Modulus), but I don't know how much pressure can be applied on the FCPBGA package.
Is there any information available from Freescale regarding about the maximum pressure that can be applied without damaging the package?