We are using the MPL115A1. The data sheet recommends reflow in an inert environment. Is that to minimize corrosion of the part leads and board pads during reflow or is there a possibility of damaging the sensor itself?
I am not entirely sure the context of the note in the data sheet since the author did not specify but it makes sense that during the reflow process, device pins to PCB contact pads are subject to oxidation when the boards are soldered in a standard air environment which can result in soldering defects. These soldering defects can be minimized if an inert gas such as nitrogen is used during the reflow process.
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