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About connection of 22μF bulk capacitor on PCB for i.MX6

Question asked by yuuki on Oct 14, 2015
Latest reply on Oct 20, 2015 by Artur Petukhov

Dear all,

 

I found the following description in Hardware Development Guide.

 

"The distance should be less than 50mil between bulk cap and VDD_xx_CAP pins.Decoupling capacitors such as 0.1 μF or 0.22 μF should also be used. A 22 μF bulk capacitor must be placed as near as possible with pins/vias.

The distance should be less than 50mil between bulk cap and VDD_xx_CAP pins."

"The 22 μF bulk capacitors should be placed as close as possible to the associated VDD_xx_CAP ball, with trace widths and via sizes appropriate to the expected current draw.

A trace length of less than 50 mil is recommended."

 

I have some questions about these contents.

 

<<Question1>>
How should I understand this 50mil?

 

Does this mean the distance from a Through Hall(Via) (connected to MX6's VDD_xx_CAP pin) to a 22 μF bulk capacitor?
or
Does this mean the distance from a MX6's VDD_xx_CAP pin to a 22 μF bulk capacitor?
(Does this include thickness of the PCB?)

 

Please refer to an attached file.
- distance 50mil.pdf

 

<<Question2>>
Does the SABRE SD board meet these specifications?

 

<<Question3>>
What kind of problem occurs if I cannot meet these specifications in our original board?

 

May I have advice?

Best Regards,
Yuuki

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