Dear Sir or Madam,
Hello. I have a question about the BGA ball count in i.MX6SL.
First, refer to Table 71. 13 x 13, 0.5 mm BGA Package Details in i.MX 6SoloLite Applications Processors for Consumer Products, Rev. 3.
"Ball Count = 432"
Next, refer to 2.1 Basic design recommendations in Hardware Development Guide for i.MX 6SoloLite Applications Processor, Rev. 1.
"The ball-grid array contains 24 rows and 24 columns, making it a 576 ball BGA package."
Which is right description?
And, refer to 6.2.3 13 x 13 mm, 0.5 mm Pitch Ball Map in in i.MX 6SoloLite Applications Processors for Consumer Products, Rev. 3.
i.e. Does the ball exist at "NC" pins?