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MPR121 thermal reflow profile

Question asked by Jesse Enjaian on Jul 14, 2015
Latest reply on Jul 27, 2015 by Jesse Enjaian

I've assembled a couple of packages soaking at 180 C for one minute and reflowing at 249 C for about twenty or thirty seconds using 63/37 solder (not paste) that I tinned on the pads with a soldering iron. I calibrated the temperature with a thermocoupled thermometer, so I'm confident the applied heat is about that; I'm using a head that's about the size of the MPR121 and soaking the entire chip instead of going side-by-side. Does this sound safe for the MPR121, or am I risking damaging it?

 

Thanks!

 

Jesse Enjaian

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