In the data sheet for the MPL3115A2, you will note that they do have a land pattern drawing seen on page 37 and see in the screen shot below. I shows both the package outline and PCB landing pattern, but does not make a specification regarding the solder paste requirements. Is there a recommendation somewhere?
I ask about this because I have done quite a few designs with LGA footprints. Typically, they have particular instructions for the solder paste layer or solder stencil opening. For instance, this Freescale document for different LGA package has very specific instructions regarding the paste layer/stencil opening.