P2040 chip packaging, baking, reuse from tray

[vinodstanly]

1. Our P2040 chip comes in tray. During production if a packet is opened and there are chips left and has to be stored for the next build, whether it need to be baked. What are the other precautions to be taken before resealing.
2. How many times a Package (with BGA chips) could be baked, kept and reused.(during part production ,case when 60 chips in tray SPQ are not used at once.)

[alexander_yakov]

1. The answer depends on how long the package contents were exposed to ambient.

For MSL level =3 and exposure time less than 12 hours - baking is not required, drying with 5x exposure time at <= 10% RH will be enough.

For exposure time more than 12 hours - baking is required.

These questions are fully answered in JEDEC standard J-STD-033.

The most recent version of this standard J-STD-033C is available from JEDEC (after registration):

https://www.jedec.org/standards-documents/results/j-std-033c

2. Assuming drying or baking procedure is performed after every exposure to reset floor life - the number of baking and re-sealing procedures is not limited.

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