Dear Sir or Madam,
Please give me a information of warp in(on) a package in i.MX6Dual.
Device: i.MX6D(Auto) MCIMX6D6AVT10AD
Warping on the BGA package may occur due to humidity on the package. I would recommend reviewing the shipping packaging conditions as well as the handling on the floor. For example,
- Is the package intact at the arrival?
-Has it been stored properly?
-Is the floor time below the Floor Life of this part in particular (168 hours, MSL=3)? In case the package has been longer than floor life or under conditions of high humidity it would require baking to eliminate moisture.
-Is the time between faces of the PCB controlled? If only one face of the PCB is finished moisture can still enter the board and certain components until wholly finished.
If the warping is found on the PCB itself it would most likely be due to the weight of the components while reflowing. In this scenario you would need to implement a PCB support jig to support the PCB during the process.
Thank you for your reply.
Please give me a document about the curve (warp) of the package in IC implementing.
There is not a dedicated document on warping of IC since it has more to do with the handling of each package. There are some JEDEC standards that should be followed to avoid warping.
That being said the following presentation might help you determine what could have caused warping on your manufacturing process. I hope it helps.
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