Can anybody confirm that the exposed pads of Kinetis KV10 devices are isolated from the die?
I can't find any information on the internal connection of the pad in the datasheet.
As normal, the exposed pad will be internal connect to die. So you can connect it to ground. Thanks.
Thanks for your reply.
So then the exposed pad should be connected to digital ground? Or might it be better for the analog performance of the chip to connect it to analog ground?
You can connect to digital ground.
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