Hi community,

I have a question about i.MX6DQ thermal resistance.

Please see Table 5 in IMC6DQCEC Rev.3.

I understand junction temperature is present by the following equation.

"Junction to Case" (< 0.1) = ("Junction Temperature" - "Case Temperature") / "Power consumption" : [equation 1]

=> "Junction Temp" = "Junction to Case" / "Power consumption" + "Case Temp" : [equation 2]

Then, should I assign "0.1" to "Junction to Case" in equation 2 to calculate "Junction Temp"?

Or can I think "Junction Temp" = "Case Temp" because "Junction to Case" is small value sufficiently?

Best Regards,

Satoshi Shimoda

For assurance, please use R theta-JC = 0.1 , especially when thermal estimations are provided for

board, that should work under "hot" environment; when the results of the calculations violate the design

requirments (if the resulting junction temperature is more than 105'C). In these case, you might use special

CFD software (e.g. FloTHERM) to make thermal analysis.