Do you have a i.MX6Q reference gerber data for build up board?
It is the best if the gerber uses same schematic as MCIMX6Q-SDP.
I see. Yes, not every PCB manufactured can do build-up technology with blind and buried vias. Nevertheless SDB is the only reference design which is available. I'm sure that you can reuse it even you use build-up technology. Use same vias or change vias, where it is enough to blind or buries ones.
You can download it from Freescale web page: i.MX6Q: i.MX 6Quad Family of Applications Processors (Hardware Development Tools -> Printed Circuit Boards and Schematics-Schematics).
Thank you for your reply.
But I heard the gerber on your web is thorough hole in service request in past.
Is this right?
If it is right, do you have any other gerber data?
Jiri Kotzian please look at it...
Hi Jiri Kotzian,
Could you reply me about this question?
not sure what do you mean by sentence "gerber on your web is thorough hole in service request in past" - please explain.
But it is true that latest MCIMX6Q-SDB uses newer design. Let me check if it is available.
> not sure what do you mean by sentence "gerber on your web is thorough hole in service request in past" - please explain.
Sorry, there is a typo.
I meant :
I can the gerber data of MCIMX6Q-SDP from Freescale web site.
However, I heard MCIMX6Q-SDP is through hole board from service request once.
So I cannot use MCIMX6Q-SDP gerber data as reference for build up board.
I was ensured that LAY-27392_C is the latest design which we have. Sorry but still I'm not sure about meaning "through hole board from service request once". Do you mean that there was some service request so SDB might be through hole?
Why you cannot use SDB reference? What technology you want?
> Do you mean that there was some service request so SDB might be through hole?
> Why you cannot use SDB reference? What technology you want?
End customer will create a i.MX6Q custom board.
Then, the custom board will be build up board, not through hole.
And they want to design a layout for their custom board same as Freescale reference board as much as possible if Freescale has a gerber for build up board.
But the SDB gerber is through hole layout, so they cannot use the SDB gerber as reference of build up board layout.
SDB uses SMT for most of components. Through holes are just for some connectors (JTAG, Eth). Especially i.MXQ is SMD. There are lot of vias, which can confuse.
Pin U1.G1 on top layer:
Via on same line like the pin:
Please note that "through hole" I said is not mention about "how to mount".
Please see the attached image what is "through hole board" and what is "build up board".
Through hole : all via penetrate all layer (from top layer to bottom layer) of a board.
Build up : some via don't penetrate all layer.
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