I am actually reviewing AN3989 and Gerbers 77066 of EVK to design my own board.
I have some question, first, EVK layer order is different from AN, what's better ?
I can't found information about impedance requirement between IMX and DDR,
EVK say 50ohm for 3mils (very thin !) and have 5.5mils trace on L1, this give around
35ohm, it is correct (particularly for two DDR chip) ?
Finally, BGA pad are 0.355mm on EVK, less than 0.43mm+/-0.06 from datasheet,
is it really safe regarding stress on solder joint ?
Thanks for your answer.