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DSC_0059 Added by iWavesystems on April 3, 2012 at 8:41am    
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i.MX6 Q7 Development Kit       The Development Platform incorporates Q7 compatible i.MX6 SOM which is based on Freescale’s i.MX 6 Series 1.2GHz multimedia focused processor and Generic Q7 compatible Development Board. This platform can be used for quick prototyping of any high end applications in verticals like Automotive, Industrial  & Medical. Being a nano ITX form factor with 120mmx120mm size, the board is highly packed with all necessary onboard connectors to validate complete i.MX6 CPU features.   Benefits Simple, low cost and yet rugged assembly thanks to the industrial temperature grade and compact (120 x 120 - Nano ITX) form factor Simple and low-cost integration thanks to the on-board standard interfaces (uSD, USB and Memory) Lowest power consumption. Typical power consumption      Highlights Ideal for quick development Shortens product development life cycle Quick customization can be done in a very shorter period Suitable for validation of any R1.20 Q7 compatible module      Features Display: 7" 800x480 TFT LCD, VGA Port/ TV Out, HDMI Port*, LVDs Display connector* Touch Panel: Resistive Touch Capacitive touch* Video Input: Camera Interface*, TV IN* Audio: External Audio Codec, Headphone/ Mic Jacks PCIe: PCIe Mini Card*, PCIex1 Port* USB: USB2.0 Device - Mini AB connector, USB2.0 Host 2 ports - Type A Connector Serial: UART - DB9 connector Storage:SATA Port1 - 7P Connector*, SATA Port2 - 22P Connector*, Standard SD Slot Communication:10/100Mbps Ethernet - RJ45 Jack, 802.11b/g/n Wi-Fi Module*, CAN Port - DB9 connector* Power: 12V DC Input, On-board RTC coin Battery Form Factor: 120 x 120 - Nano ITX Temperature supported: 0 to 60 oC      Target Applications Industrial/Medical Green Energy Controller Panel PC, High-end PDAs, Secure Devices, Industrial appliance Control, Automotive In Vehicle Infotainment Systems Medical HMI, Kiosks, POS, General Embedded     Click here for more details on the i.MX 6 Q7 Development Kit by iWave
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Habey USA's EMB-2230 is a Pico-ITX ARM Board built around an NXP i.MX6 Cortex A9 processor, featuring an expansion header like those found in development and hobbyist boards - but optimized for use in commercial and industrial products. The board brings the ease and adaptability of "maker-boards", and the reliability and long product availability life-cycle of commercial ARM boards together. Specifications: NXP i.MX6 Cortex A9 Processor 1GB On-Board DDR3 8GB (default) iNAND Flash Storage Ethernet, BT 4.1BLE, 802.11b/g/n Dual LCD Interfaces (24-Bit LVDS and MIPI DSI) Rich I/O Options, Including HDMI 3* USB (2* USB 2.0, 1* USB OTG) USB & RS-232 Headers RS-485/CAN Bus Terminal Block 40-Pin Expansion Header w/ PCIe. PoE Input Accelerate Time To Market With a Developer Friendly Design The inclusion of easy-development features on the EMB-2230 helps ensure a quick time to market for any product. Included expansion headers, terminal blocks, and available 7" and 10" touch panel LCD kits make it easy to connect any sensors, hardware, or other devices and move your product directly from development to production. Easy Expansion Modules - Or Use With Other Devices Habey offers a variety of ready to use expansion modules, offering features like PoE (Power over Ethernet) or dual GbE ports; or use the 40 pin expansion header with PCIe, CAN Bus, RS-232, UART, SPI, I2C, and other GPIO devices. Commercial Product Life-Cycle Reliability The EMB-2230 has been carefully designed for a five-to-ten year long service life-cycle, ensuring no need to constantly test and recertify products as components change. Learn more: EMB-2230 Datasheet EMB-2230 Product Page Tech News - The Maker Board Explosion and Industrial ARM Boards
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MYIR introduces a high-performance ARM SoM MYC-JX8MX CPU Module, which is built around the NXP i.MX 8M Quad processor featuring 1.3GHz quad ARM Cortex-A53 cores and a real-time ARM Cortex-M4 co-processor. The module runs Linux and is capable of working in extended temperature ranging from -30°C to 80°C.   Measuring 82mm by 52mm, the MYC-JX8MX CPU Module has integrated 1GB/2GB LPDDR4, 8GB eMMC, 256Mbit QSPI Flash, Gigabit Ethernet PHY and PMIC on board. A large number of I/O signals are carried to or from the i.MX 8M CPU Module through one 0.5mm pitch 314-pin MXM 3.0 expansion connector, making it an excellent embedded solution for Scanning/Imaging, Building Automation and Smart Home, Human Machine Interface (HMI), Machine Vision and more other consumer and industrial applications which requires high multi-media performance. MYC-JX8MX CPU Module (delivered with heat sink by default) MYIR also offers a versatile platform MYD-JX8MX development board for evaluating the MYC-JX8MX CPU Module. It takes full features of the i.MX 8M processor and has brought out rich peripherals through connectors and headers such as 4 x USB 3.0 Host ports and 1 x USB 3.0 Host/Device port, Gigabit Ethernet, TF card slot, USB based Mini PCIe interface for 4G LTE Module, WiFi/BT, Audio In/Out, HDMI, 2 x MIPI-CSI, MIPI-DSI, 2 x LVDS display interfaces, PCIe 3.0 (x4) NVMe SSD Interface, etc. It is delivered with necessary cable accessories for customer to easily start development as soon as getting it out-of-box. A MIPI Camera Module MY-CAM003 is provided as an option for the board.                                                                       MYD-JX8MX Development Board MYIR offers 1GB or 2GB RAM selections for the CPU modules and development boards which have very-high powered prices to compare. Part No. Item Processor LPDDR4 eMMC Unit Price MYC-JX8MQ6-8E1D-130-E MYC-JX8MX  CPU Module NXP i.MX 8M Quad Processor based on 1.3GHz Quad ARM Cortex-A53 and 266MHz Cortex-M4 cores  (MIMX8MQ6CVAHZAB) 1GB 8GB $99 MYC-JX8MQ6-8E2D-130-E 2GB $119 MYD-JX8MQ6-8E1D-130-E MYD-JX8MX Development Board 1GB $279 MYD-JX8MQ6-8E2D-130-E 2GB $299 Supports extended working temperature ranging from -30°C to 80°C.
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Hi all.  The display does not output normally. 1. This is the screen of the problem. 2. This is a screen that should come out normally.  Therefore, it is necessary to review whether the settings are correct in the bootloader and the kernel. Below are the system information and tasks. - Hardware system Module: Apalis iMX6, Ixora Carrier Board v1.1 LVDS 2 port : LA123WF4-SL05, 12.3”WU (1920 X RGB X 720) TFT- LCD - Operation system boot2qt : Boot to Qt for Embedded Linux 2.3.4 bootloader: U-Boot 2016.11-dirty kernel : Linux version 4.1.44-2.7.5+g18717e2 - LCD timing - Device Tree of kernel, arch/arm/boot/dts/imx6qdl-apalis.dtsi mxcfb1: fb@0 { compatible = "fsl,mxc_sdc_fb"; disp_dev = "ldb"; interface_pix_fmt = "RGB24"; default_bpp = <24>; int_clk = <0>; late_init = <0>; status = "disabled"; // "okey" in arch/arm/boot/dts/imx6qdl-apalis-ixora-v1.1.dtsi }; &ldb { status = "okay"; split-mode; // dual-mode; lvds-channel@0 { reg = <0>; fsl,data-mapping = "spwg"; /* "jeida"; */ fsl,data-width = <24>; crtc = "ipu2-di1"; primary; status = "okay"; display-timings { native-mode = <&timing01>; timing01: 1920x720 { clock-frequency = <89400000>; hactive = <1920>; vactive = <720>; hback-porch = <96>; hfront-porch = <30>; vback-porch = <3>; vfront-porch = <3>; hsync-len = <2>; vsync-len = <2>; }; }; }; lvds-channel@1 { reg = <1>; fsl,data-mapping = "spwg"; fsl,data-width = <24>; crtc = "ipu1-di0"; status = "okay"; display-timings { timing02: 1920x720 { clock-frequency = <89400000>; hactive = <1920>; vactive = <720>; hback-porch = <96>; hfront-porch = <30>; vback-porch = <3>; vfront-porch = <3>; hsync-len = <2>; vsync-len = <2>; }; }; }; }; - u-boot env vidargs=video=mxcfb0:dev=ldb,1920x720@60,if=RGB24, video=mxcfb1:off video=mxcfb2:off video=mxcfb3:off - kernel log : [ 0.244330] MIPI DSI driver module loaded [ 0.244682] ldb 2000000.aips-bus:ldb@020e0008: split mode [ 0.244951] ldb 2000000.aips-bus:ldb@020e0008: split mode or dual mode, ignoring second output [ 0.245615] 20e0000.hdmi_video supply HDMI not found, using dummy regulator [ 0.247074] mxc_sdc_fb fb@0: registered mxc display driver ldb [ 0.262134] mxc_sdc_fb fb@0: 1920x720 h_sync,r,l: 2,30,96 v_sync,l,u: 2,3,3 pixclock=89405000 Hz [ 0.272800] imx-ipuv3 2800000.ipu: IPU DMFC DP HIGH RESOLUTION: 1(0,1), 5B(2~5), 5F(6,7) [ 0.306740] mxc_sdc_fb fb@0: 1920x720 h_sync,r,l: 2,30,96 v_sync,l,u: 2,3,3 pixclock=89405000 Hz [ 0.354510] Console: switching to colour frame buffer device 240x45 [ 0.389237] mxc_sdc_fb fb@1: mxcfb1 is turned off! [ 0.389484] mxc_sdc_fb fb@2: mxcfb2 is turned off! [ 0.389720] mxc_sdc_fb fb@3: mxcfb3 is turned off! : - Run fbset of target root@b2qt-apalis-imx6:~# fbset mode "1920x720-60" # 😧 89.405 MHz, H: 43.655 kHz, V: 59.966 Hz geometry 1920 720 1920 1440 24 timings 11185 96 30 3 3 2 2 accel false rgba 8/16,8/8,8/0,0/0 endmode Is there anything else to check? Thanks.
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http://www.youtube.com/watch?feature=player_embedded&v=RzmsFxb3EcQ   Uploaded by Digidotcom on Jul 30, 2010 For more information visit http://www.digi.com/products/embeddedsolutions/connectcore-wi-mx51.jsp. Category: Science & Technology License: Standard YouTube License  
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Dear,   Now we could use USB port for program downloading, do we have serial port download tools for i.mx6UL? For Jlink tools, now it could start running with Jlink, but after power off and power on, the target will not start. Do you have the image which could download to QSPI norflash by Jlink, and after power on, the target board could running.
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Airbus connected factory to shorten Time To Market, Remy’s Martin connected bottle to avoid counterfeit, Schlindler’s elevator smart sensors to improve security, Cisco-IBM connected port in Colombia to enable predictive maintenance, these are some successful examples of B2B IoT creating value and business, and there are many more to come. MACKINSEY ASSESS THAT 70% OF POTENTIAL VALUE ENABLED BY IOT SHOULD COME FROM B2B! McKinsey Global Institute – “The internet of Things: mapping the value beyond the hype” – June 2015 A growing number of companies understand the potential of IoT for B2B markets and its trillions dollars’ revenue expected in 2020 (from 3 to 20 depending on sources and studies). That said, you don’t develop a bluetooth key ring the same way as a sensor designed to monitor temperature in a hot caustic reactor lost in the middle of nowhere and requiring 99,9% availability. While B2C IoT main challenges will remain business application and datamining, B2B brings an additional complexity to the device and its direct environment (gateway, other IoT devices, IT, etc). That is why we make a distinction between the “sexy” IoT focused on B2C and its challenges (marketing, business model, retention, etc.) and what we call the “serious IoT” which is more related to industrial and B2B stakes. This article is the first of a series where I aim to describe the whole process of IoT project development, from a business point of view as well as a technical point of view I will start with this first article by giving what I believe is the best methodology to start a BtoB or Industrial IoT project.   What are the challenges of serious IoT? What are the key success factors to launch a product? What to begin with and which steps to follow? THE FOUR PILARS TO SUCCEED IN AN IoT PROJECT Before I dig into the process to follow, let’s share some key success factors that I’ve identified in all the IoT projects I’ve seen and run: Design thinking As IoT is “hype”, many companies want IoT to launch a project and forget that simple saying: “no pain, no gain”. If there is no pain to be addressed with the project, it will certainly end up in the archive box of the data room. Design thinking allows to have a consumer-centric approach at each stage of the development and ensures your project/product relieves pain, brings a benefit for the customer (even if customer is internal). Master a wide range of technologies MacKinsey assess that system interoperability represent 40% of the potential value of IoT revenue. The “inter” of interoperability means that companies would need partners mastering many different technologies to have all layers/devices work together. In the embedded/IoT world, this can easily exceed 50 technologies (HW architectures, OS, radio & network protocols, frameworks, applications, etc.).  So the success of an IoT project, and more widely of an embedded project, is moving from a technical “silo” expertise to a system approach coupled with technical expertise. Designing the device itself also requires a wide range of expertise and a system approach to optimize the whole system based on business application requirements. Reliable partners (either for technologies or distribution channel) This is often called ‘open innovation’, a term that can freak out CEOs or CTOs. It is simply the fact that you build your project involving partners at each stage to create more value.  As IoT impacts every single bloc of the business model (distribution channel, revenue mode, communication, key activities, key resources, etc.), not a single company can have every related asset internally. So finding the right partners, and sharing value with them, is key to manage and roll-out the project Agile approach This is another “buzz” word. But it is not so obvious for companies not coming from the software industry or coming with a pure embedded software mindset and its 'waterfall approach'. IoT sees many new comers discovering the software challenges, and trying to apply their regular development processes (V cycle for example) to the IoT project. That is the best way to burn it in endless discussions on product scope, spend a lot of money on redeveloping things, and delaying your project launch forever. WHERE AND HOW TO START YOUR IoT PROJECT? Now you’re thinking: “Hmm, interesting, thanks Mr Consultant for this completely un-operational advice. But that doesn’t help me to start”. Don’t you leave now, here is the practical part! These are the first steps to follow when you want to manage an IoT project: 1. START WITH ''WHY'' As Simon Sinek would say, you’d better start with the “why” before launching any useless project. So, why do I want to launch an IoT project? Do I want to launch something that makes my company look trendy and innovative? Do I want to save cost by optimizing my business processes (maintenance, operation, production, etc.)? Do I want to enable new business models into my company offer, thanks to the IoT opportunities (renting vs selling, data value, new services, service vs product, etc.)? Do I want incremental innovation to refresh some of my products? Do I want to use the project as a Trojan horse to digitalize my company? Over the past few years, I have seen all of these motivations among management teams, and all of them are fine. But, you cannot pursue all those goals at the same time, and you certainly won’t design the same project depending on the choice you make. As we say in French “choisir, c’est renoncer” which would translate into something like “Choosing is giving up”. So take time to clearly state your motivations and then select one that needs to guide your focus in the coming months. 2. DESIGN USE CASES AND MAKE ASSUMPTIONS  Easier said than done, but first forget about technology/product, and just think about what IoT could allow in your environment and to which customer this could be most valuable. Draw several customer “journeys” and see where innovation could be used as painkiller or gain creator. Let’s take the example of a maintenance scenario. The idea is the allow remote action for on field devices. For instance, coffee machines installed into gas stations all over Europe. In that case, ask yourself how IoT could make maintenance more efficient? Try to assess time gain, money gain, and security gain and quantify it. Let’s say you identified that among 1000 machines installed, you have a high chance of having 5 customer claims per week and therefore 5 diagnosis to be done per week. Can IoT help you run the diagnosis remotely? Can IoT help you solve the problem remotely? In that case, will that save all on site trips? How much money would that save for the company operating the machines? Knowing that, you can start building a first draft of business models making assumptions: how much of that value can you take? What is the business model you can build around that? How much will it affect your customer process? Have you got the right distribution channel to sell this new offer? Which key assets and activities would you need to bridge the gap between current status and this innovation? 3. GET OUT THE BUILDING Use cases and key assumptions in your pocket, you will now need to go and meet potential customers and partners. The more you share, the more your project will evolve to a credible scenario. Who in your existing base can be your early adopters? Who are your customer having the pain you ease at the highest level (and it is even better if they try to solve it themselves with a workaround). In our example of remote maintenance, they would have some artisanal webcam system on each site to see the machine state and detect some issues without any on-site intervention. Once you’ve identified 5 to 10 contacts, go out and meet them, and try to understand several things : the high level stakes, the problem they have on the field, the way they have tried to solve it, the change process and stakeholder, and then (and only then) you can present your innovation and collect feedbacks. A few slides are enough to present. There is no need for a prototype or any bigger investment. You will be amazed on the quantity of information you can collect that way. And remember something: don’t listen to what people say, look at (or try to understand) what they actually do. 4. BUSINESS MODEL AND FUNCTIONAL SPECIFICATIONS You had your first iteration, congratulations! You wrote down assumptions, you went on the ground to test them, and you collected valuable insights from your targeted customers. Maybe your assumptions proved fully wrong, then go back to stage 2! Otherwise, lucky you, you can write down a v1 of the business model and define your product functional specifications better. This is where you can start defining features, functionalities, prices, offers, channels, technical constraints, cost, financial figures, etc. At the end of this stage you will have some kind of a business plan, a sales pitch, functional specifications, and maybe even technical specifications for your IoT project. 5. POC, POC, POC  That is one of the hardest part of any innovative project: build a Proof Of Concept and test it. Questions are: what are the key features/attributes that I need to test to prove that my concept makes sense for customers? How can I do that as cheap as possible in order to keep my budget for the real product? You’ll need to be very smart, or pay some smart provider, to be able to degrade your end vision so much to just keep the key attributes you want to test. If we go back to the remote maintenance example, can you build some basic software on a Raspberry Pie Board connected to the machine, coupled with a basic web interface that give critical information on the machine, for instance power consumption, run time, temperature, etc. Even if the final product won’t be using raspberry, if you want the web interface to be embedded into an app, and if you want to have twice as much indicators, just focus on the key elements. And test. Doing so, you’ll allow your customer to see real progress, to feel involved in the development process, and to influence the final outcome. And on your side you will collect key information that would take months or even years to collect if you had done it on the real product. A Proof Of Concept can be a functional prototype, or a design prototype, or both. That is pretty much depending on the project and again on the key attributes/functionalities you want to test. 6. ANOTHER LOOP TO COME Congratulation, you’ve made another loop. You are about to become expert in so called “iterative development”! If you don’t feel so, don’t worry as you’ll have many other loops following the same process: make assumptions, test, measure, learn, adjust and make new assumptions, test, measure … Each loop will allow you to adjust the business model, the functional specifications, the customer engagement and go further into your product development. The complete ''Lean startup process'' The key is to keep in mind that your goal here is not to have the perfect product. It is just to be able to learn as much as possible in each loop while spending as less as possible. Make as many loops as you can until you reach a satisfying v1 product brief. But that is for chapter 2… Originally Written on WITEKIO Technical Blog by Samir Bounab, Chief Sales Officer, WITEKIO 15 September 2017
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The i.MX53 General Market Launch at Embedded World Added by Marsha Chang on March 8, 2011 at 6:34pm The i.MX53 launch was successful at Embedded World in Nuremberg, Germany. We had many partners demoing i.MX53 solutions as well as the i.MX53 Quick Start board showing HD1080p video decode and the i.MX53 Tablet reference design (SABRE Platform for Tablets). For more information, visit www.freescale.com/imx53.  
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This the document for SUSPEND and WAKE-UP in IMX8QM-MEK platform Wake up done by following, M4  debug UART A53 debug UART Power Key Source: imx-p9.0.0_2.1.1-auto-ga CONFIGURATION          Disable the default wake-up - RTC Timer (Patch - Disable_auto_wakeup.diff) SUSPEND      1. Command  Line,             # echo mem > /sys/power/state      2. Dumpsys Command                  # dumpsys activity service com.android.car inject-vhal-event 0x11410a00 4,2 WAKE-UP     1. BUTTON          By pressing the power-key SW3 (0.5s)      2. DEBUG UART          Enable debug UART wake-up          # cat ./sys/devices/platform/5a060000.serial/tty/ttyLP0/power/wakeup          disabled          # echo enabled  > ./sys/devices/platform/5a060000.serial/tty/ttyLP0/power/wakeup          TO WAKEUP                   Press the ENTER Key 2 times 3. M4 UART WAKEUP                        Apply the RPMSG patch (L4.14.98.diff)                                        # cat./sys/devices/platform/5a070000.serial/tty/ttyLP1/power/wakeup          disabled          # echo enabled > ./sys/devices/platform/5a070000.serial/tty/ttyLP1/power/wakeup Type some input in M4 Cosole               
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Hi. We are using iMX6 SABRESD board with ltib-4.1.0. We need blit functionality for OpenGL framebuffer objects. It is present in OpenGL GL_EXT_framebuffer_blit extension, but is missing on iMX6. We use QOpenGLFramebufferObject class from Qt. There is blitFramebuffer() method that was working fine on desktop and Android devices. Its method hasOpenGLFramebufferBlit() returns false on iMX6 which means extension is not present. As expected, blitFramebuffer() itself is not working (screen remains black). We need this extension enabled. Why is it missing on iMX6 and is it possible to add it? Regards, Federico
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This 4 days in-depth technical training targets OEMs and customers starting the development of a Linux + Android based device with ARM architecture. It covers all the aspects related to the use of Linux and Android for Embedded system, including kernel architecture, development tools and Environment, BSP adaptation and custom drivers development and Android image creation, deployment and debugging. With a 3-days “base content” plus 1 optional day on advanced debugging technique and advanced drivers development concepts, this course offers the maximum flexibility to match attendees expectation. As part of its collaboration with Freescale, Adeneo Embedded will offer to each attendee the i.MX 6 series development board built to Freescale SABRE Lite design used during the training, to allow customers continuing their evaluation and development after the class. For registration : Invitation_Training_Android_Boston_July_2014 / All static html / Media - Adeneo Embedded
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Bitcoin is a cryptocurrency which is quite popular among many investors, tech enthusiasts, and some digital sellers/buyers due to its flexible, anonymous and robust nature.  BFG Miner is a bitcoin miner which has the ability to mine bitcoins on a range of devices from ASIC, to FPGA, to GPU, to obsolete CPU systems. This article will guide you step by step to do bitcoin mining on a i.MX8x platform by using the bfgminer. 1) Download the necessary software. bfgminer https://github.com/luke-jr/bfgminer.git jansson https://github.com/akheron/jansson.git uthash https://github.com/troydhanson/uthash.git 2) Cross compile the software: bfgminer: ./configure --prefix=${YourDirectory} --host=aarch64-linux-gnu --enable-scrypt --enable-cpumining --without-libevent --without-libmicrohttpd make jansson ./configure --prefix=${YourDirectory} --host=aarch64-linux-gnu make If everything runs correctly, you should get the following binaries and libraries: Ubuntu14:/opt/output$ ls -R .: bin include lib sbin share ./bin: bfgminer bfgminer-rpc start-bfgminer.sh ./include: jansson_config.h jansson.h libbase58.h libblkmaker-0.1## ./include/libblkmaker-0.1: blkmaker.h blkmaker_jansson.h blktemplate.h ./lib: libbase58.la libbase58.so.0 libblkmaker-0.1.la libblkmaker-0.1.so.6 libblkmaker_jansson-0.1.la libblkmaker_jansson-0.1.so.6 libjansson.a libjansson.so libjansson.so.4.10.0 libbase58.so libbase58.so.0.0.2 libblkmaker-0.1.so libblkmaker-0.1.so.6.1.0 libblkmaker_jansson-0.1.so libblkmaker_jansson-0.1.so.6.1.0 libjansson.la libjansson.so.4 pkgconfig 3) Install those binaries and libraries onto the i.MX8x target filesystem under directory /usr/bin and /usr/lib. Run the following command to start mining: #bfgminer -o stratum+tcp://us.ss.btc.com:1800 -u nxa001.001 -p ""  
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An inquisitive visitor viewing i.MX6 Q7 Quad display Added by iWavesystems on June 26, 2012 at 3:51am    
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2a Added by Ruslan on June 15, 2012 at 12:29pm    
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澳洲大学挂科怎么办联系QQ1252839746,考试挂科作弊、GPA低被开除退学、收到学术警告。澳洲大学2018 S1的Final成绩已经在陆续发放了,拿到成绩的时候,有些人难免会沮丧,复习了的内容没考,考的内容没复习,所以就有科目理所应当的挂科了…… 澳洲大学向来是宽!进!严!出!随着成绩的公布,小伙伴们都在问挂科了到底该怎么办?一起来了解一下不同情况的挂科该如何处理吧! 同一学期挂科科目挂科小于等于50% 什么叫挂科科目小于等于50%呢?各大学的课程设置都是一学期4门课,如果你在一学期中挂了1-2门,但是还没有出现double fail(一科已经连续fail两次以上),那么学校不会对你有任何行动,下学期一定要争取4门全部Pass来弥补! 同一学期挂科科目挂科大于等于50% 大于等于50%的意思就是如果在一学期中挂了2门以上课程,那一般学校就会采取第一次行动了,会对你发出一封警告信! 学校出勤率低于80% 和挂科无关,但非常重要。如果同学们在一学期中,因各种原因出勤率不满80%的,并且针对这过低的出勤率没有合理的理由,学校也会先对你做出警告需要解释,如果理由没有被学校接受,学校也有资格将你上报移民局,移民局可以会跟据情况取消签证。 努力学习却还是挂科 如果是平时十分努力却还是掌控不了挂科的同学门要及早正视自己的问题,对自己挂科的原因进行总结,可能是由于专业不适合,学习能力不够,学校和你的学习理念存在差异……而这类学生最重要的就是正视自己的情况考虑转学校或者是换专业。 警告信解释 当你不幸收到开除警告信后,书面解释的质量非常重要。 首先,解释列举的原因,一定是不可控的因素,由此导致的学习成绩差;接着表明自己坚信可以完成学业,并列举理由;最后认真的规划应该如何去克服困难,努力提高成绩。 如果以身体健康原因作为理由,必须准备辅助材料,如医生开具的证明等,一同上交。校方受理后会决定十分需要召开听证会,听证会后即会给出解释结果。 转校 这里需要提醒小伙伴们如果被公立大学开除,则无法转到其它公立大学继续学习,只能转到各种私立大学或学院,但可以在收到学校警告信后,马上开始准备转学事宜,在开除程序正式开始之前申请转学。 转学 若未读满6个月的课程就申请转学,首先需要获得想转学学校OFFER,然后向在读学校申请Release letter(放行信),在读学校会根据转学政策和程序审核申请,再决定是否发放Release letter; 如果已经在主课学校就读超过六个月,一般学校都会同意学生的转学申请。 在澳洲挂科除了昂贵的学费外,还有可能会面临强制退学和取消学生签证,并且3年都不得进入澳洲,所以要谨慎对待每次考试,澳洲大学挂科改成绩(Q1252839746)挂科GPA成绩修改,解决被退学开除等问题。
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img-0002-fsl-ptx Added by Robert Schwebel on November 10, 2010 at 6:45pm   i.MX at the Freescale booth
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iWave, a reliable embedded solutions provider has now optimized the booting time of its Windows Embedded Compact 7 (WEC7) BSP for Freescale’s SABRE SDP/B platform. Now the WEC7 OS is booting in a short period of time  ~3 seconds for a small footprint OS image with display and touch drivers support, and boot time of ~8 to ~10 seconds for an OS image with basic drivers and OS components support. Why boot time optimization? WinCE7 is a real time OS which will be used in performance-critical applications such as automotive and healthcare units. In most of the cases, booting time will play important role, e.g. if the device is used in rear-view camera system in automotive field, the user needs the device to start working as soon as the reverse-gear is applied. This requirement needs the device to boot and start the camera application within few seconds. This demands a very short OS boot time. Some of the techniques which can be applied for efficient boot time optimization are discussed in this article. Boot phases in WEC7: Boot-loader (eboot) Copying of OS image from booting device (e.g. Micro-SD) to RAM OAL Layer Driver initializations and file system mounting Guidelines for reducing the boot time in different booting phases of WEC7: Boot-loader (eboot): Remove the code that initializes a hardware which is not required in boot-loader. E.g. If booting device is micro-SD, the initialization of NAND is not necessary. So, this redundant code needs to be removed. The eboot menu in eboot is important for debugging of WEC7 OS. But it is not needed in an end product. So, the delay for this eboot menu can be completely removed to reduce 3 seconds of time. In few platforms such as Freescale’s SABRE platform, a default splash screen is used, which updates continuously. This can be removed, and a static splash screen can be displayed, which can save a few milliseconds of time. Remove unnecessary serial debug prints. Copying of OS image from booting device (e.g. Micro-SD) to RAM: This time increases as the size of WEC7 OS image increases. So, select the OS components carefully and remove redundant components from OS image so that the OS image can be copied to RAM quickly. Also remove unnecessary registry keys, dlls and libraries to reduce the OS size. Optimize binary image builder (.bib) file to reduce the run-time image file. Implement Multi-BinFS OS binaries to reduce the OS copying size. As the functionalities/driver supports goes on increasing, WEC7 image size increases. So, the time required to copy the image increases, and RAM size needed to store the OS image increases. The Binary ROM Image File System (BinFS) can fix the two issues. In a BinFS file system, the WEC7 OS binary is divided into multi-binary Image files, and only the one binary (less than 5MBs) is copied into the RAM by the boot-loader. The components in the other binary files are copied into the RAM only when they are required to run. Links that can be referred to implement multi-BinFS in WinCE:      MSDN documentation: http://msdn.microsoft.com/en-us/library/aa516960.aspx; An implementation guide by Freescale: http://cache.freescale.com/files/dsp/doc/app_note/AN4137.pdf You can also include compressing-decompressing mechanisms in boot-loader to achieve even shorter copying time. OAL layer: Remove the code that does unnecessary hardware implementations. Skip the initializations that already done in eboot. Remove any wait/loop/delay if exists. Remove unnecessary serial debug prints. Driver initializations and file system mounting: Analyse and remove all the redundant drivers, check for any loop, wait or delay sequences in driver initialization code. Load any applicable drivers (e.g. USB, sensors) after the OS boot (i.e. after user sees a desktop/application). In WEC7 OS, a driver can be either loaded during booting using device manager/GWES, or can be loaded dynamically whenever necessary. This can be achieved easily by changing the registry key configurations to remove the driver from built-in drivers, a small application to load the driver after OS boot-up, and registry settings to launch this application automatically once the OS is booted. To decide the load order, it is important to check the dependencies of/on a driver. Use appropriate splash screen/progress bar while user waits for OS booting. Remove unnecessary serial debug prints. By effectively following the techniques mentioned, WEC7 based platforms can achieve reduced boot time for quick application access. iWave has optimized the WEC7 booting time on Freescale’s SABRE SDP platform. The booting time is as low as ~3 seconds for a WEC7 OS with standard shell, LCD display, DDraw, I2C and touch driver support, and ~8 to 10 seconds for WEC7 OS with following components: Standard shell Display DDRAW Capacitive touch screen MicroSD USB host – Mass storage and HID Ethernet GPU (OpenVG/GL) Multimedia codecs DirectShow Audio Video Playback Ambient Light Sensor Accelerometer SMP PWM Backlight I2C Debugging using KITL For further information or inquiries please write to mktg@iwavesystems.com or visit www.iwavesystems.com
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