Now we are debugging audio quality with sgtl5000 on i.mx6DL platform. The test audio curve is attached, what we need now is to get 8dB more gain at 90Hz and 15dB more at 5KHz. Can anyone help on setting regs in sgtl5000 codec?How? Thanks in advance.
Вебинар по продукции TechNexion "Процессорные платы на базе iMX6 (ARM)" OK, maybe not everyone of you speak Russian. For example I don't speak. But I know there is a big Russian community out there, developing great stuff just like the rest of us by using ARM Processors. This Friday Ilya from IPC2U will hold a Webinar to give a Technical overview about the capabilities ARM processors have and how you can use them in today's world. I had a chat with Ilya and he told me he is planing to give a overview why ARM now is more suitable to be used in many different industrial areas due to increased capabilities and the increased usability of Linux. I had the luck that Ilya gave me an overview about what he will present, so even my Russian is limited (limited as in 'non existing') I still get some useful updates, even for me. The Link to register is here: http://ipc2u.ru/news/webinars/processornye-moduli-na-imx6-arm/ It's at 11:30 Moscow time (I guess, please check link above) and the Agenda is like this: Темы вебинара: Что такое ARM Семейство процессоров iMX6 на базе архитектуры ARM Cortex-A9 О компании TechNexion Обзор продукции компании TechNexion (встраиваемые системы, панельные компьютеры) Подробный обзор процессорных модулей формата PICO Talking with Ilya he told me this Agenda is roughly and he will cover like this: -ARM overview -ARM for industrial usage -NXP and it’s ARM i.MX6 Processors -TechNexion Product overview -TechNexion PICO Modules in detail -Q&A I don't know if there is a limit in maximum people to attend but 1h ago Ilya told me he is overwhelmed by the sign up rate of people... ..so you better hurry if you speak Russian and want join! Hey you are attending? Tell me here how it was after it, ok? Looking forward to hear from you Florian P.S.: I work for TechNexion. Thats the Company IPC2U is talking about in this Webinar, just to be clear about that. Me: florian12
PMIC PF3000/3001 + i.MX 6UL Resources: ========================================================================================================================= Upload the latest version D as enclosed, SCH-29105 KIT6UL_3000EVM Version D and SCH-29105 KIT6UL_3000EVM Version D. The attachment SCH-29105 KIT6UL-3000EVM Version C.zip includes i.MX 6UL 14x14 + PMIC PF3000(KIT6UL-3000EVM, SCH-29105 Rev.C) related files: No. Files in SCH-29105 KIT6UL-3000EVM Version C.zip 1 SPF-29105_C.pdf is the corresponding schematic PDF version. 2 SCH-29105_C.zip is the schematic. 3 LAY-29105_C.zip is the PCB layout. 4 750-29105_C BOM.xls is the BOM. Its i.MX 6UL 14x14 + PMIC PF3000 BSP: Apply PF3000 driver patch in imx_3.14.52_1.1.0_ga http://git.frees cale.com/git/cgit.cgi/imx/linux-2.6-imx.git/commit/?h=imx_3.14.52_1.1.0_ga&id=e5a7a72cd51a585b8f1a1e299bf88fff44b94440 Apply 0001-add-pf3000-on-imx6ul-evk-board.patch, see the attachment. Apply 0003-correct-arm-soc-regulator-for-pf300.patch, see the attachment. Apply 0001-u-boot-add-pf3000-support-on-imx6ul-14x14-evk-board.patch, see the attachment. 2. Update customer board dts as the above 0001-add-pf3000-on-imx6ul-evk-board.patch. ========================================================================================================================= The attachment SCH-29090 KIT6UL-3001EVM Version C.zip includes i.MX 6UL 14x14 + PMIC PF3001(KIT6UL-3001EVM, SCH-29090 Rev.C) related files: No. Files in SCH-29090 KIT6UL-3001EVM Version C.zip 1 SPF-29090_C.pdf is the corresponding schematic PDF version. 2 SCH-29090_C.zip is the schematic. 3 LAY-29090_C.zip is the PCB layout. 4 750-29090_C BOM.xls is the BOM. Its i.MX 6UL 14x14 + PMIC PF3001 BSP: Apply PF3001 driver patch in imx_3.14.52_1.1.0_ga http://git.freescale.com/git/cgit.cgi/imx/linux-2.6-imx.git/commit/drivers/regulator/pfuze100-regulator.c?h=imx_3.14.52_1.1.0_ga&i d=19708058f049be9a5dcc81943d1b9a14080367e8 Update PF3001 dts board file as customer board dts. Thanks, PMIC team: Sean Liu
This video shows how the Crank Storyboard application framework is well suited to run on our i.MX7 Nitrogen7 board. Demo details This demonstration is based on the following: Nitrogen7 board 800×480 LCD display Resistive touch Yocto Jethro release Linux kernel 3.14.52 Crank Software details Crank Software Inc. is an innovator in embedded graphical user interface (GUI) solutions. Their products and services enable R&D teams and UI Designers to quickly and collaboratively develop rich animated user interfaces for resource-constrained embedded. The demo above relies on the Crank Storyboard Engine which is: Multi-platform Supported on Linux, Android, QNX, WindowsCE among others Built for embedded Storyboard Embedded Engine scales from low-end to high-end processors 3D optimized For higher end products embedding a GPU For more information, please visit: https://boundarydevices.com/crank-software-demo-on-nitrogen7/
2016 May 16 - 19 we will again be at the NXP Technology Forum. Formerly called ftf it is now the NXPFTF 2016 TechNexion will be there and show our latest small Modules or chat with you about our Software and where to get it. Of course we are also looking forward to see all the new cool things we are expecting NXP to show. Being exited to have our tiny PICO Module scaling from Cortex-A7 i.MX6 Ultralite over Cortex-A9 single/dual lite/quad or with the NXP i.MX7 solo and dual (both Cortex-A7) but also introducing our other solutions. I'm sure there are a lot of customer which will find our EDM solution the perfect fir for their needs: We are looking forward to meet yo and all the other amazing people and exchange our ideas! For sure it will be a great event, also if now under a slightly different name, but that's still ok FTF, here we come!! Register here: http://www.nxp.com/support/classroom-training-events/nxp-ftf-tech-forum:NXP-FTF-TECH-FORUM-HOME nxpftftechforum
e-con Systems designed & implemented a reliable Machine to Machine (M2M) solution for mobile phone tower monitoring based on eSOMiMX6, an NXP-Freescale iMX6 SOM. Read further to know the challenges faced and how the team executed the system. M2M Solution for Cellphone Tower Monitoring Customer Requirement: System to monitor several parameters such as, temperature, smoke, power source, door open, diesel level etc. in the cell phone tower and remotely monitor them through cloud. The system should monitor and raise alarm when the values exceeded the threshold limit; it should send a text message to the authorities. Challenges: The main challenge in designing the system started with the electrical & electronics and high noise with ESD & EMI signals. It was very important to design the system in such a way that it could interact with the sensors and at the same time, should not be affected by radiated or conducted electromagnetic disturbance. The system cable faced high ESD & EFT injections & the temperature had to be maintained under 25° to power up the system. Approach: e-con Systems designed an architecture based on eSOMiMX6 system on modules that is highly reliable. The system was proposed to extract the information about the tower & communicate the same with cloud. Amazon cloud based web services was used on the cloud side to monitor various parameters & to send the alerts. Base board implemented with eSOMiMX6 interacted with all sensors, collected the information and same would be transmitted via a GPRS unit or Ethernet or wireless unit. Depending on the availability, system selected one path & EMI/EMC/ESD events protected the path of information collection. Power saving modes was designed keeping in mind product power consumption & the total power used when running in diesel generator. The product was tested in-house with simulated tower environment for 2 weeks (24/7) continuously. All issues were identified and addressed. e-con Systems worked with the customers at all levels to get the necessary certification approval. Conclusion: Customer is now successfully selling the robust product in the market. The tower monitoring business is now highly profitable as breakdowns were brought down to nearly zero
Abstract: Browsers and mobile applications are using WebRTC for audio and video Real-Time Communications (RTC) via simple APIs. The WebRTC components have been optimized to best serve this purpose. WebRTC based web application provides rich, real-time multimedia features (think video chat) on the web, without any plugins, downloads or installs.It’s purpose is to help build a strong RTC platform that works across multiple web browsers, across multiple platforms. iWave has developed WebRTC based Peer to Peer audio and video communication on i.Mx6 Qseven development platform. iWave is using FireFox web browser and its in built webrtc api’s for the communication. Architecture of WebRTC Detailed Description: iWave’s i.Mx6 Q7 platform has Quad core processor which can operate up to 1 GHz speed/core. i.MX6 CPU is NXP’s latest achievement in integrated multimedia application processors which is part of growing multimedia-focused products that offers high performance processing and are optimized for lowest power consumption. iWave’s i.Mx6 Q7 platform supports 1GB RAM in 64bit mode with eMMC memory of 4GB which can be used both as Mass storage and boot device. i.Mx6 Q7 also supports Ethernet port which is integrated i.Mx6 CPU and connected to the external Gigabit Ethernet PHY on SOM. iWave’s Application consist of two components – clients and server. Peer to Peer communication is done between two clients. Server is used for registering the clients and to keep the necessary set up for two clients to communicate. After setting up, the server is not having any role in the communication. Client Application: Client application is very simple web application using WebRTC to transport audio and video between two clients. The application will enable one client to "dial" the other client and make a video call (with audio).This application only works between two clients. It can be run using Firefox browser Server: The server brokers the initial connection between the two clients. Once a connection is established between the clients, their communication continues in a peer to peer mode: none of the video data is routed through the server. Working Process of WebRTC Peer to Peer communication Audio Codec: Audio codec supported by WebRTC is OPUS codec .OPUS codec Supports constant and variable bit rate encoding from 6 kbit/s to 510 kbit/s, frame sizes from 2.5 ms to 60 ms, and various sampling rates from 8 kHz (with 4 kHz bandwidth) to 48 kHz. The Acoustic Echo Canceler present in WebRTC removes the acoustic echo resulting from the voice being played out into the active microphone. Noise reduction component removes certain types of background noise usually associated with VoIP. Video Codec: Video codec supported by WebRTC is VP8. The VP8 video codec is well suited for RTC since it is designed for low latency. WebRTC has dynamic video jitter buffer for video which conceal the effects of jitter and packet loss on overall video quality. Image enhancement removes the video noise from image captured from camera. WebRTC call: A Screenshot of WebRTC peer to peer audio and video communication Benefits: WebRTC is In-built in Firefox browser. Improved video and audio streaming. VP8 video codec and OPUS audio codec provides much less data transmission without packet loss. WebRTC based Peer to Peer communication can be run from firefox browser without any plugin or software installation. Audio and Video streaming can be done local networks. For more information please visit: WebRTC Peer to Peer Communication(Audio & Video) on i.MX6 board | iWave Systems or contact email@example.com
NXP’s i.MX6UL3 Cortex A7 based power efficient CPU integrates comprehensive security features such as TRNG, Crypto Engine (AES with DPA, TDES/SHA/RSA), Tamper Monitor, Secure Boot, SIMV2/EVMSIM interfaces, OTF DRAM Encryption, PCI4.0 pre-certification etc. This makes the i.MX6UL3 CPU as very ideal solution for the electronic point of sale (ePOS) applications. iWave Systems being one of the early adaptor of the i.MX6UL CPU, launched cost effective i.MX6UL3 based SOM for POS applications where power consumption, small form factor and security features are very critical. The IMX6UL3 SOM module is equipped with 256MB of DDR3 RAM, which is expandable up to 1GB. 256MB of NAND flash is supported on the SOM which is also expandable higher memory configuration. All the IO peripheral interfaces supported by imx6 ultra lite CPU is available through 200 pin SODIMM edge connector. i.MX6UL SODIMM Module By using the proven i.MX6UL3 SOM, a POS unit can be quickly realized by developing an application specific base board with the following features; EMV compliant Smart card, magnetic swipe reader, Thermal Printer, key pad, Finger print sensor, TFT display, 2G/3G module, Wi-Fi/BT modules, NFC reader, Micro SD card, USB OTG and battery support. iWave’s i.MX6UL development board can be used for quick POS prototyping and application development. The development kit includes Imx6ul3 SOM module,base board with multiple USB ports, Micro SD, RGB display, camera port, audio In/Out, multiple UARTs, PWM interface, I2C, GPIOs etc.This is ideal starter kit for connecting all the necessary POS specific interface modules and quick prototyping of POS application. You can kick start your POS product design with this Industry latest i.MX6UL3 SOM now by ordering the i.MX6UL development board from the following link; http://www.iwavesystems.com/product/development-platform/i-mx6ul-development-kit.html
iWave provides Android Lollipop and Linux 3.14 kernel BSP upgrades for its i.MX6 based products. iMX6 Board: From the launch of i.MX6 application processors, iWave Systems, a global leading SOM supplier has launched many variations of i.MX6 CPU modules and an SBC board catering to Industrial, automotive and medical applications. Complying with the Qseven R2.0 specification, the i.MX6 Q7 SOM supports industrial grade operation with 70mmx70mm size. The i.MX6 MXM SOM supports automotive grade i.MX6 CPU and the automotive specific interfaces with 314 pin MXM2 connector pinout in 85mmx85mm form factor. The recently launched i.MX6 SODIMM SOM module supports both commercial & industrial operating temperature with very compact form factor of 67.6mmx37mm. iMX6 Board Single Board Computer: Measuring 100mmx70mm, the Pico ITX size i.MX6 SBC board supports on-board connectors for all the i.MX6 interfaces with option to expand IOs through expansion connector. All these three different form factor System on Modules and Single Board Computers are supported with different i.MX6 CPU variations such as Quad, Dual, Dual Lite & Solo. Besides this i.MX6 Qseven modules also supports i.MX6 Quad Plus and i.MX6 Dual plus CPU configurations. To enable quick prototyping of these different form factor SOMs, iWave systems supports independent development kit variation for each form factor SOMs with Linux, Android and WEC7* BSP support. These development kits help customer to save up to 60% of new product development cycle sothat the quick time to market can be achieved. All these i.MX6 products are getting Android Lollipop and Linux 3.14 kernel BSP upgrades which will be available for customers by the first quarter of 2016.
It sounds almost like a tale: Every Year again all the Experts of the Embedded Market meet in a little old Town in the Forrest of Bavaria. They are coming from all nations in flying machines to see the latest inovation and talk to each other in a language filled with Buzz words only few might understand if they not belong to this totally Engineering group.... Also this Year Embedded World took place like always in end of February. I have been on a few times on Embedded Worlds now, but it is always great to go again. Every year there is something new to spot and I also enjoy to meet old friends and silicon vendors to discuss about the latest evolution/revolution. This Year I attended the Show for TechNexion and we showed our latest Products based on NXP's ARM chips, like our tiny PICO Modules which are also available with NXP i.MX6UL now and the ideal choice for multimedia applications or where not much space is available. With i.MX6 and i.MX7 options it ofers a nice scalability. Not to forget the fitting baseboard which makes us the HW provider of choice for NXP and Google for the Brillo OS Of Course we also showed our EDM Modules, the work horse of the industry. Reliable. Rugged. Open Source Standard. With 82mm x 60mm it's a small formfactor with a great scalability from Single to DualLite or Quad core. And of course also available with i.MX7 New have been our TEK-Series, a Series of ruggedized, fan-less, cable-less BoxPC's with a Modular approach so Customer can choose the right configuration from off-the-shelf components Also new have been our TEP-Seriees, which is a Series of HMI's ranging from 7" to 10" and 15", also based on the same modular, cable-free- fan-less approach like the TEK-Series. Embedded World has been very busy for us, but never less we found the time to record a video, introducing our Company (for the few who don't know about us yet..) and in the second half of the video having a detailed introduction of our new products. You can watch the video here: TechNexion Company Introduction (@Embedded-News.TV) or directly on YouTube here: TechNexion Company Introduction and Product presentation (@YouTube) Thanks all our visitors and Looking forward to see you again next year!! Any Questions in the meantime? Contact us!
Hello i.MX6 Users, We have created a innovative application wherein you can create a i.MX6 dual lite hardware design as per your customised requirement in a minute. Creating a new design is super easy where you need to add the processor, peripheral requirements and the board input power input to the application. With these input requirements the application will 1. Find peripheral , power, clock, reset and power sequencing components 2. Find processor pin mux options 3. Optimise the power, clocks 4. Generate the design and draw the schematic to be viewed online. It is a powerful algorithm meant exclusively for high end processors like i.mx6. You can generate any number of designs using our application hosted at www.circuit-tree.com. We will shortly be expanding our library and also add more form factors to support different hardware designs. Let us know if you have any questions/concerns/feedback. Thanks Circuit tree team
iWave Systems launched two additional SOMs based on i.MX 6QuadPlus (iMX6QP) and i.MX 6DualPlus(iMX6DP) adding to its existing i.MX6 SOM portfolio. The new i.MX6QP and i.MX6DP CPUs from NXP provide increased memory bandwidth without any major changes in the software and hardware. This provides 90% enhancement in the memory efficiency compared to i.MX6Q / i.MX6D. The 2D and 3D graphic engine performance of these new QP and DP devices are improved more than 50% compared to the predecessors- i.MX6 Quad and Dual core devices. Check the performance improvements of i.mx6QP / i.mx6DP device here . iWave Systems launched the i.MX6 QuadPlus and DualPlus CPU based Qseven compatible System On Modules (SOMs) at the same time as NXP launched the i.MX6 QP/DP chipsets. These modules are supported with Linux and Android BSP support. More information about imx6QP / imx6DP modules can be found here .
In May of 2015, Forlinx Embedded Tech. Co., Ltd launched a new item based on i.MX6 serial microprocessor, both quad-core and dual lite-core are optional. Its features are as below: 1)i.MX6Q CPU module features i.MX6Q base board features: 2) i.MX6DL features: Both i.MX6Q and i.MX6DL share one CPU module and one base board. But SATA interface is only available for the quad-core board. They have excellent performance of OS Android, both multi-screen displaying and displayings are possible on it. Besides, as many companies are now engaged in EV Charger Billing Unit project or solution, i.MX6 will be a best backup option based on its advantages of LVDS and multi-screen For more details pls refer to our homepage www.forlinx.net or send emails to firstname.lastname@example.org Hardware Interface S
23 February 2016, Nürnberg, Germany : Toradex is pleased to announce a new member of its System on Module (SOM) product line based on the NXP i.MX 7 series applications processors. The processors offer an excellent performance/power ratio, advanced security features, and a heterogeneous multicore architecture based on ARM ® Cortex-A7 and Cortex-M4 cores, which make the platform a perfect fit for products targeting the rapidly growing IoT market. Some of the features of new SOMs: Colibri iMX7S and Colibri iMX7D are; NXP i.MX 7Solo and i.MX 7Dual applications processors 1x/2x ARM ® Cortex-A7 up to 1GHz & 1x Cortex-M4 at 200MHz 256MB/512MB RAM, 512MB on-board Flash Asymmetric/ Heterogeneous multicore processing Low power consumption/ high efficiency Advanced security features Connectivity: CAN, Ethernet, USB, I2C, UART, etc. Multimedia: Touch, RGB, Camera Parallel Interface, Analog Audio, etc. Temperature range -20° to 85° C The additional Cortex-M4 core is tailored for time-critical applications. This unique heterogeneous multicore architecture allows to clearly separate real time tasks from any server or GUI-related applications. The i.MX 7 processor also includes many additional security features such as secure boot, cryptographic acceleration and tamper detection, which are of high value for the IoT market. Toradex's internal benchmarks prove the effectiveness of the new architecture used for i.MX 7 processors. While the performance is comparable to the very successful i.MX 6Solo processor (ARM ® Cortex-A9 1GHz) SoC, the power consumption in operating mode is in the range of the Colibri VF61 (ARM ® Cortex-A5 500MHz) or less than 75% of the power consumption of i.MX 6Solo. When looking at the standby mode, i.MX 7 requires even less than a third compared to the power consumption of i.MX 6Solo. *Results are based on nbench benchmarking, which uses a single-core, so performance & power consumption figures are comparable between dual-core i.MX 7Dual and single-core SoCs such as i.MX 6Solo, VF61 & VF50 The Colibri iMX7S/D SOMs are an extension to the robust and compact Toradex embedded computing SOMs and customized Single Board Computers (SBC), which are used in variety of industries such as industrial automation, medical, automotive, robotics and many more. Toradex’s products are ideal for quickly creating proof-of-concepts as well as scaling seamlessly from prototypes to tens of thousands of devices, without the need to redesign the embedded computer. “We are happy to be one of the first companies in the world providing a product based on the NXP ® i.MX 7 series. This processor offers an upgrade path from our pin-compatible VFxx-based platforms while retaining the unique combination of two different cores on the same die. By controlling sensors and actuators through the Cortex-M4 core and running non-time critical tasks on the Cortex-A7 core, many customers can massively reduce both the system complexity and the BOM cost. This great product is another result of a longstanding and strong partnership between Toradex and NXP,” said Stephan Dubach, CEO, Toradex. “NXP is looking to drive wide adoption of the i.MX7, critical to our success are system level board designs from our partners that enable our customers to effectively accelerate time to market. Toradex’s Colibri i.MX7 SOM is a highly efficient, powerful module that offers advanced security features in a small form factor. This combined with an extensive ecosystem, will allow customers to immediate start development and shorten time to market,” said Robert Thompson, Chief Enablement Architect for i.MX applications processors, NXP Semiconductors. Technical Specifications: Technical details of Colibri iMX7 SOMs can be found at https://www.toradex.com/computer-on-modules/colibri-arm-family/nxp-freescale-imx7 Availability: Toradex’s Colibri iMX7 SOMs will be available for sales from 23 February 2016 on the Toradex webshop . Webinar: Toradex is hosting a webinar on 09 March 2016 with NXP. Register now: Introducing the i.MX 7 System-on-Chip - presented by Toradex and NXP About Toradex: Toradex is a Swiss based company with offices around the world, offering ARM ® -based System on Modules (SOMs) and Customized SBCs. Powered by NXP ® i.MX 6 , i.MX 7 & Vybrid , and NVIDIA ® Tegra processors, the pin compatible SOMs offer scalability in terms of price, performance, power consumption, and I/Os. Complemented with direct online sales and long-term product availability, Toradex offers direct premium support and ex-stock availability with local warehouses. https://www.pinterest.com/pin/create/extension/
Horw, Switzerland : Toradex is pleased to announce the availability of a Technical Preview of Windows 10 IoT Core on an ARM-based System on Module (SOM). The Technical Preview is designed to test and evaluate the new features of Windows 10 IoT Core on an industrial grade embedded computing platform. To kick start the evaluation, Toradex offers a Starter Kit for a limited time at a promotional price. The kit comes with a Colibri T30 SOM and Iris carrier board plus required accessories. This Technical Preview is based on Colibri T30 powered by NVIDIA ® ’s Tegra 3, a powerful ARM Cortex-A9 Quad Core embedded processor. Colibri T30 supports accelerated DirectX ® graphics, provides low level hardware access, and is part of the Azure IoT Certified Program . Looking at other ARM-based products supporting Windows 10 IoT Core, one key differentiator is that Toradex computer modules are designed to be used in industrial end products. Today, Colibri modules are being deployed successfully in customer applications targeted for Industrial Automation, Medical, Automotive, Point of Sale, Defense and many other verticals. Stephan Dubach, CEO of Toradex AG, said, “Toradex is happy to be able to offer this new IoT platform to embedded developers. It will enable them to take advantage of the Universal Windows Apps and Universal Windows Drivers being portable from big servers down to lean IoT clients. Alongside with the widely known and highly estimated Visual Studio development environment, as well as the added security of Windows 10 IoT Core, and Azure IoT Suite, this platform will allow developers to test and evaluate the capabilities of this new operating system on an industrial platform.” The Technical Preview is limited in terms of features. Over time, Toradex intends to extend features and add Windows 10 IoT Core support for its other ARM-based SOMs, based on customer feedback. Details on the feature limitations can be found at http://developer.toradex.com/winiot and more information on Toradex’s strategy for Windows 10 IoT Core can be found at http://developer.toradex.com/knowledge-base/toradex-windows-10-iot-core-pro-strategy . At the upcoming Embedded World, 2016 on 23 rd -25 th Feb, Toradex will be showing multiple demos on Windows 10 IoT Core and Azure IoT, at booth 1-639, Hall 1. Toradex engineer, Valter Minute, will be giving a talk on “Windows 10 IoT Core: From the Embedded Device to the Cloud and Back”. A recorded webinar on “Introduction to Windows 10 IoT Core” is published at https://www.toradex.com/webinars/introduction-to-windows-10-iot-core . About Toradex: Toradex is a Swiss based company with offices around the world, offering ARM based System on Modules (SOMs) and Customized SBCs. Powered by NXP ® /Freescale i.MX 6 , i.MX 7 & Vybrid , and NVIDIA ® Tegra processors, the pin compatible SOMs offer scalability in terms of price, performance, power consumption, and I/Os. Complemented with direct online sales and long-term product availability, Toradex offers direct local premium support and ex-stock availability with locations in Switzerland, USA, India, Brazil, China and Japan.
27 January 2016, Horw, Switzerland: Toradex is pleased to announce its new initiative: Hardware Partner Program. The intention of this program is to offer Toradex customers an ecosystem of third party hardware that is compatible with its ARM®-based System on Modules (SOMs). Currently, the program includes Carrier Boards, Carrier Board and Display combos, and Panel PCs. Toradex’s extensive free design resources and service partner network make it fast and simple to create a customized carrier board. However, off-the-shelf solutions may be more desirable in cases where especially fast time-to-market and low development cost are required. The new Hardware Partner Program supplements Toradex’s own Customized Single Board Computers offering and further expands the off-the-shelf solutions that are available to its customers. Stephan Dubach, CEO, Toradex adds, “Toradex is committed to offer a complete ecosystem of hardware and software that complements its robust ARM-based System on Modules. We already have a successful service partner program, which includes third party companies who can help our customers with their software and hardware services. The new Hardware Partner Program will supplement our existing hardware ecosystem by offering more choices of off-the-shelf hardware to our customers, and thus help them in speedy project development.” The entire list of third party hardware is available at https://www.toradex.com/support/partner-network/hardware. About Toradex: Toradex is a Swiss-based company offering ARM-based System on Modules (SOMs) and Customized SBCs. Powered by NXP®/Freescale i.MX 6, i.MX 7 & Vybrid, and NVIDIA® Tegra processors, the pin- compatible SOMs offer scalability in terms of price, performance, power consumption, and I/Os. Complemented with direct online sales and long-term product availability, Toradex offers direct local premium support and ex-stock availability in locations such as Switzerland, USA, India, Brazil, China, and Japan.