RT1064 LFBGA196 0.8mm Pitch PCB Footprint suggestions

[samsaprunoff]

Good day All

I was curious if anyone has had any issues and/or suggestions on the MAPBGA196 / LFBGA196 0.8mm Pitch PCB foot print used on the RT1064 and other devices?  The NXP document on this footprint (SOT1968-1) does provide some suggestions regarding the landing, soldermask, and pastemask sizes, however, I thought I would ask those on here that have assembled these devices and if the NXP suggested sizes are suitable or if other sizes may be better.

Thanks in advance!

Cheers,

Sam

[samsaprunoff · Accepted solution]

Good day All,

I downloaded and reviewed the RT1176 EVK and examined its PCB's BGA footprint.  Although the RT1176 is a larger BGA (289 pins 14x14mm) than the RT1064 (BGA196 12x12 mm) the BGA pitch is the same (0.8mm) along with the ball size (0.43mm dia) the layout details will be the same.  It seems that NXP themselves do not follow the suggested landing, solder mask, or paste mask size.  Both the BGA289 and 196 NXP documents suggest the following:

landing size: 0.34mm diameter

paste mask: 0.34mm diameter

solder mask: 0.44mm diameter

However, NXP's EVK has the following:

landing size: 0.305mm diameter

paste mask: 0.305mm diameter

solder mask: 0.509mm diameter

Given the above I will follow NXP's EVK BGA footprint, as this is what they choose for their PCB design.

Cheers,

Sam