Hello jay_heng,
Thank you for your quick reply.
I say that RT1170 documents have 3 different type FCB.
| | Name | NOR | NAND | offset | Reference |
1 | Flash Configuration Block | O | | 0x0000 | AN12238 3.2.1 Bootable image |
| 2 | FlexSPI Configuration Block | O | O | 0x0400 | IMXRT1170RM 10.6.3.1 FlexSPI Configuration Block |
| 3 | Firmware Configuration Block | | O | 0x0000 | IMXRT1170RM 10.6.4.3 Firmware Configuration Block (FCB) |
I hope to know about 1.Flash Configuration Block (FCB) explained in the application note AN12238.
flexspi_nor_config_t is Table 10-18. Serial NOR configuration block in IMXRT1170RM and
it is include 2.FlexSPI Configuration Block as a struture member memCfg.
In Reference Manual 10.6.1.2 FlexSPI Serial NOR Flash Boot Operation, it say that
1. The ROM expects the 512-byte FlexSPI NOR configuration parameters (as explained
in the next section) to be present at offset 0x400 in Serial NOR flash attached to
FLEXSPI_A_SS0_B.
And Reference Manual 10.6.3 Serial NOR and NAND Configuration based on FlexSPI Interface, it say that
The ROM SW supports Serial NOR and Serial NAND based on FlexSPI module, using a
448-bytes common FlexSPI configuration block and several specified parameters for
Serial NOR and Serial NAND respectively.
The other hand, 3.Firmware Configuration Block (FCB) is allocate to offset 0x0000 but it is NAND only.
Both 2.FlexSPI Configuration Block and 3.Firmware Configuration Block (FCB) aren't match
to 1.Flash Configuration Block (FCB).
So, I ask that do you have any information about Flash Configuration Block (FCB) in
application note AN12238?

Best regards,
Ishii.