Hi All
I would like to make a part 2 to this thread: https://community.nxp.com/t5/i-MX-RT/High-Current-Draw-on-SNVS-IN-with-imxrt-1062/m-p/1370981
I am rather worried about the current consumption on battery backed up mode, which is specified to be typically 20uA.
My EVKs measured about 60uA and prototypes between 40uA and 60uA.
Today I did the following with a couple of new i.MX RT 1062s:
1. They were originally not soldered into a board so I carefully applied 3.0V between the BGA balls VDD_SNVS_IN and a GND pin. The current was about 50uA
2. I then had two i.M RT 1062s soldered into their boards with NO other components (this ensures all GND pins are connected together). The currents was about 40uA on one board and about 50uA on the other (the same as in 1, when that chip not soldered in).
Therefore from my experience with EVKs and chips on and off boards (and 1051, 1052, 1062 based designs on custom boards with chips from different batches) the current (and thus the batter backup current - with and without RTC running) has always been between 40uA and 60uA.
This shows an average value of around 50uA with deviation of +/-20%.
This is of course not in accordance with the data sheet's typical 20uA (with no variation details).
What does this mean? Is the spec too low or is there something missing in the measurement or circuit details? Is there some way to reduce it and achieve the claimed value by ensuring other pins are set to a certain state?
Thanks in advance
Regards
Mark