[Technical Note]i.MX RT1170 JEDEC Compatibility

[#1]

This article uses i.MXRT1170 as an example, but the rules apply to the i.MX RT series.

1. Backgroud and Questions

• DataSheets (e.g, RT1170A , RT1170B) show the 'NON JEDEC' Package as following, but the Product quality page (e.g MIMXRT1172AVM8A) is marked as WSL 3 (Moisture Sensitivity Level 3), which is one of the moisture sensitivity levels defined in JEDEC-STD-020.
  • Is there a contradiction?
  • Does the product comply with JEDEC-STD-020? 

2. What is JEDEC-STD-020?

• JEDEC-STD-020 is a standard that defines the moisture sensitivity level (MSL) and preconditioning requirements for surface-mount devices (SMDs) during the reflow soldering process.
• Compliance with this standard means that the device's storage and handling before reflow soldering meet industry specifications, making it suitable for automated manufacturing environments.

3. WSL 3 and JEDEC-STD-020 Compliance

 On NXP’s product quality page, some i.MX RT1170 variants are marked as WSL 3 (Moisture Sensitivity Level 3), which is one of the levels defined in JEDEC-STD-020. This means:

• The device can be exposed to ambient conditions for 168 hours before reflow soldering; 
• It must be stored in dry-pack packaging;
• It complies with JEDEC-STD-020 handling and processing requirements.

This indicates that i.MX RT1170 series have been tested and qualified according to JEDEC-STD-020. Key parameters from NXP Product pages：

• MSL (Moisture Sensitivity Level): 3
• Peak Package Body Temperature: 260°C
• Time at Peak: 40 seconds
  
  

4. “NON JEDEC” Packge in the Datasheet

In the i.MX RT1170 datasheet, some package types are labeled as “NON JEDEC”, which typically means:

• The package dimensions or layout do not strictly follow JEDEC standard outlines;
• The device has not undergone the formal JEDEC-STD-020 certification process.

For example, the IMXRT1170BCEC Rev.1 datasheet states:

Package Information: Plastic Package 289-pin MAPBGA, 14 x 14 mm, 0.8 mm pitch
Package Type: NON JEDEC [1]

This indicates that the package is not a JEDEC-standard mechanical outline. However, it does not necessarily mean the device fails to meet the moisture sensitivity requirements defined in JEDEC-STD-020.

5. In summary

• 'NON JEDEC' refers only to mechanical form, not to reliability standards.
• The "NON JEDEC" marking on a datasheet refers to the ​​physical package outline​​, while the MSL 3 rating on the product quality page is a ​​reliability and handling specification​​ determined through JEDEC test methods.
• JEDEC-STD-020 is a moisture sensitivity level testing standard for non-hermetic surface-mount devices. i.MX RT explicitly states that its MSL rating is based on the JEDEC-STD-020 testing process.
• Whether a package conforms to a JEDEC standard (such as MO-220) has no direct bearing on whether it can be tested under JEDEC-STD-020.

• ‘NON JEDEC’是指物理封装中的机械形式，不是可靠性标准。
• JEDEC-STD-020 是针对非气密性表面贴装器件的湿敏等级测试标准；
• NXP 明确表示i.MX RT产品 MSL 等级是依据 JEDEC-STD-020 测试流程；
• 封装是否为 JEDEC 标准（如 MO-220）与是否能进行 JEDEC-STD-020 测试无直接关系。

6. Reference

• NXP i.MX RT1170 Product Page: https://www.nxp.com/part/MIMXRT1172AVM8A 
• i.MX RT1170 Datasheet: https://www.nxp.com/docs/en/data-sheet/IMXRT1170CEC.pdf 
• JEDEC-STD-020 Standard: https://www.jedec.org/document_search/field_doc_type/151?search_api_views_fulltext=%E2%80%8BJ-STD-02...