iMX8M Mini Footprint Recommendation?

[tom_perman]

I have taken a look through the i.MX 8M Mini Hardware Developer’s Guide but there does not seem to be any specific advice relating to the PCB footprint.

Specifically the size (diameter) of the BGA pads which are recommended for use with this BGA package. 

Should I simply use the same BGA pads as used on the iMX8M Mini EVK board?

[gusarambula]

Hello Tom Perman,

You may find the package information for the LFBGA486 used on the i.MX8MM on the link below.

https://www.nxp.com/packages/SOT1967-2

We do not provide a footprint per se, but you may use the same BGA pads used on the i.MX8M Mini EVK and even import the symbol from the Design Files for the i.MX8M Mini EVK.

I hope this helps!

Regards,

[tom_perman]

Hi,

In the absence of a specific footprint does NXP have a more generic application note regarding the footprint design / soldering to be used with their BGA packages?

Here is a guide which Micron produced for their devices : https://www.micron.com/-/media/client/global/documents/products/customer-service-note/csn33_bga_user... 

Thanks,

Tom

[gusarambula]

Hello Tom, 

We do have a solder profile Application Note that may be of help. Please find it on the link below:

https://www.nxp.com/docs/en/application-note/AN3298.pdf 

I hope this helps!

Regards,