i.MX8M mini MSCALE_DDR_Tool - LPDDR4 Calibration Fails

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i.MX8M mini MSCALE_DDR_Tool - LPDDR4 Calibration Fails

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matt_callicoat
Contributor I

Testing custom SOM layout of IMX8M Mini with LPDDR4.  The calibration routine fails at step 1.  I am wondering what kind of hardware problem this would tend to indicate.  The DDR Tool fails calibration with the following output:

*************************************************************************
ARM clock(CA53) rate: 1200MHz
DDR Clock: 1500MHz

============================================
DDR configuration
DDR type is LPDDR4
Data width: 32, bank num: 8
Row size: 16, col size: 10
One chip select is used
Number of DDR controllers used on the SoC: 1
Density per chip select: 2048MB
Density per controller is: 2048MB
Total density detected on the board is: 2048MB
============================================

MX8M-mini: Cortex-A53 is found

*************************************************************************

============ Step 1: DDRPHY Training... ============
---DDR 1D-Training @1500Mhz...
PMU: Error: CA Training Failed.
PMU: ***** Assertion Error - terminating *****
[Result] FAILED

-------------

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igorpadykov
NXP Employee
NXP Employee

in general yes, one can try x-ray screening for poor solder connection.

Also one can tweak ATxImpedance / ODTImpedance / TxImpedance  parameters

mentioned on https://community.nxp.com/thread/511246 

Best regards
igor

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igorpadykov
NXP Employee
NXP Employee

Hi Matt

for possible problems one can recheck "tab “BoardDataBusConfig” and sect.4.2 Run

DDR Calibration and generate DDR initial code described in MSCALE DDR Tool User Guide

included in ddr test package.

Best regards
igor
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matt_callicoat
Contributor I

I am using the same LPDDR4 as the NXP demo board; the only difference is that I'm using the higher speed grade -046 rather than -053, which I don't think should cause this failure.  I started from the excel file MX8M_mini_LPDDR4_RPA_v14.xlsx which has Micron MT53D512M32D2DS-053 WT:D.  I modified the data bus according to my layout and used the generated DDR stress test file, but the failure is the same.  I am wondering if a failure at this stage of the calibration might indicate a poor solder connection on the PCB.  Would this failure be consistent with a poor connection?

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igorpadykov
NXP Employee
NXP Employee

in general yes, one can try x-ray screening for poor solder connection.

Also one can tweak ATxImpedance / ODTImpedance / TxImpedance  parameters

mentioned on https://community.nxp.com/thread/511246 

Best regards
igor

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matt_callicoat
Contributor I

After repeated reflow the prototype worked.  We had a reflow profile issue.  Thanks.

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