Hi!
I see a difference in the footprint recommended in the datasheet and in the HW Guide related to the pad size of the iMX8 MINI.
A 0.3mm BGA pad is recommended in the datasheet.
![FOOTPRINT.png FOOTPRINT.png](/t5/image/serverpage/image-id/270049iBAE129603A898A22/image-size/medium?v=v2&px=400)
However in the HW guide suggest you that is not necessary and HDI to fanout these BGA with 3mils trace/distance
![IMX8MMHDG.png IMX8MMHDG.png](/t5/image/serverpage/image-id/270050iAE963C3244C8D4AC/image-size/medium?v=v2&px=400)
The BGA pads for achieving the 3.2mils is 0,255mm pad
![FANOUT_255.png FANOUT_255.png](/t5/image/serverpage/image-id/270051i7D99F343959318A7/image-size/medium?v=v2&px=400)
![PAD.png PAD.png](/t5/image/serverpage/image-id/270052i85197054586F1030/image-size/medium?v=v2&px=400)
Moreover in the iMX8 MINI evaluation board the pad seems to be 0,255 too
![sergioibarra98_0-1711319047350.png sergioibarra98_0-1711319047350.png](/t5/image/serverpage/image-id/270053iE4F8DA83E3657B54/image-size/medium?v=v2&px=400)
Someone has tested to assambly these boards with 0,255mm BGA pad in order to fanout the second round and avoiding HDI dessign?
Thanks!