i.MX6D HAB_TYPE: PRODUCT. Not support yet.

[ed_yang]

I enable the HAB function, and burn the related SRK / SEC_ONFIG fuse.

When I try to use the stress tool, it can not work and return the "HAB_TYPE: PRODUCT. Not support yet."

So, if any method can be done, for this board to execute the stress tool?

[ed_yang]

Hi Yuri Muhin,

I know how to sign the image with HAB.

I've already boot it up.

I want to know how to use stress tool in HAB enabled board.

We have to use stress tool to calibration or stress with DDR for figuring out the issue, because the RMA board(return).

[Yuri]

Hello,

  I am afraid, this is practically impossible, since sources are not provided. 
Perhaps it makes sense to apply to NXP marketing. 

Regards,

Yuri.

[ed_yang]

Hi Yuri Muhin,

   Okay. thanks for your support.

BR,

ED Yang

[Yuri]

Hello,

  only signed images can run under enabled HAB.

The stress tool is not signed. Please refer to app note AN4581 how to do it.

"Secure Boot on i.MX50, i.MX53, and i.MX 6 Series using HABv4"

https://www.nxp.com/docs/en/application-note/AN4581.pdf 

Have a great day,
Yuri

-----------------------------------------------------------------------------------------------------------------------
Note: If this post answers your question, please click the Correct Answer button. Thank you!
-----------------------------------------------------------------------------------------------------------------------