Hi community,
I have a question about i.MX6DL SD/MMC Manufacture Mode in chapter 8.11 of IMX6SDLRM (rev.1).
Could you let me know what boot config in Table 8-15 is applied when i.MX6DL enters to SD/MMC MFG Mode?
Actually, I want to use this mode and want to boot from eMMC if i.MX6DL fails booting from SD card.
If i.MX6DL checks BOOT_CFG setting associated GPIO input value in SD/MMC MFG Mode, I don't use this plan because BOOT_CFG1[5] is set to "0" for SD card boot and other BOOT_CFGx settings are not match for eMMC boot.
Best Regards,
Satoshi Shimoda
Solved! Go to Solution.
The main idea of SD/MMC manufacture boot is using additional (emergency) boot option with minimal BOOT_CFG settings.
According to sectoin 8.11 (SD/MMC Manufacture Mode) of the RM,
this mode is entered automatically, when internal boot failed.
So, no need for special boot mode settings.
Hi Yuri,
> So, no need for special boot mode settings.
Sorry, I want to confirm what config is applied when i.MX6DL enters the special boot mode, not how to enter this mode.
In other words, how i.MX6DL understand what device (SD or eMMC) is connected to uSDHC1 or uSDHC2 interface when internal boot failed.
If the answer is "i.MX6DL scan BOOT_CFGx setting when SD/MMC Manufacture Mode also", I understand why the NOTE in chapter 8.11 says "Secondary boot is not supported", and I understand I don't use my plan.
Best Regards,
Satoshi Shimoda
Regarding your question "how i.MX6DL understand what device (SD or eMMC) is connected to uSDHC1 or uSDHC2 interface when internal boot failed", the manufacture mode reads the Card Detect pins to find out which SDHC port to use.
In MX6SDL both SD1 and SD2 can be used in manufacture mode. The pins used for SD1_CD is GPIO_1 and SD2_CD is GPIO_4 respectively.
In MX6SL only SD1 can be used in manufacture mode. The pin used for CD signal is KEY_ROW7"
MX6Q does not support manufacture mode.
Hi Yuri, Peter,
You know i.MX6SDL check boot config by BOOT_CFG pins written in Table 8-15 in IMX6SDLRM Rev.1 when normal boot mode.
According to your replies, I understand checking BOOT_CFG2[4:3] pins is not needed because i.MX6SDL finds a device by CD pins when SD/MMC manufacture boot.
But I think i.MX6SDL cannot boot correctly if i.MX6SDL doesn't check BOOT_CFG pins.
For example, i.MX6SDL doesn't understand which device (SD or MMC) is connected to SD1 or SD2 if i.MX6SDL doesn't check BOOT_CFG1[5] also in SD/MMC manufacture boot.
So I guessed i.MX6SDL should check BOOT_CFGx pins (except BOOT_CFG2[4:3]) even if it is in SD/MMC manufacture boot.
If my thinking is wrong, could you catch up my misunderstanding and how i.MX6SDL decide boot settings?
Best Regards,
Satoshi Shimoda
The main idea of SD/MMC manufacture boot is using additional (emergency) boot option with minimal BOOT_CFG settings.
Hi Yuri,
> additional (emergency) boot option with minimal BOOT_CFG settings.
OK, I understand almost BOOT_CFG settings are not checked.
Then, could you let me know what BOOT_CFG is checked in the SD/MMC manufacture boot?
(e.g. only BOOT_CFG1[5] is checked)
Best Regards,
Satoshi Shimoda
Below is differnece between normal boot and Manufacture boot :
"Boot ROM will not detect the CD signal in the normal boot process, expect when goes into Manufacture boot, after Primary boot failed."
Hi Yuri,
Could you give me a reply?
I have to judge whether I an use the following method I wrote in the first submit or not.
> Actually, I want to use this mode and want to boot from eMMC if i.MX6DL fails booting from SD card.
Best Regards,
Satoshi Shimoda