Is there anywhere document similar to PCB layout guidelines for NXP MCUs in BGA packages for i.MX7 MCU where I can find exact figures for its BGA footprint (land pad, soldermask diametar...), recommended via fanout etc?
Or even better if I could find footprint to download for it.
Tnx,
Regards
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Hi Indir
please look at Hardware Development Guide for i.MX7Dual and 7Solo Applications Processors
sect.3. i.MX7 Series Layout Recommendations
http://www.nxp.com/files/32bit/doc/user_guide/IMX7DSHDG.pdf
Best regards
igor
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Hi Indir
please look at Hardware Development Guide for i.MX7Dual and 7Solo Applications Processors
sect.3. i.MX7 Series Layout Recommendations
http://www.nxp.com/files/32bit/doc/user_guide/IMX7DSHDG.pdf
Best regards
igor
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Note: If this post answers your question, please click the Correct Answer button. Thank you!
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Yes I have that document but there is no information about land pad. There is mentioned to use Allegro footprint prepared by NXP but there is no such thing online for this MCU. In worse case I will use gerbers from SABER dev board to create footprint.
Tnx