Hi Team,
We developed a customized board for our application with MIMX8ML8CVNKZAB SOC. During our thermal test, we observed that at 55 °C, our board is getting shutdown. This is due to the default thermal shutdown at 95 °C junction temperature.
As per the reference manual, the SOC Thermal Shutdown temperature can be configured up to 105C.
Now we are planning to configure the thermal shutdown temperature to 100 °C.
So, is it worth changing the thermal shutdown temperature to 100 °C? or do we have any risk of doing this?
Can NXP provide any views or comments on this?