Hi to All,
Please help me with the following question from our customer:
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I am looking for detailed thermal information on the imx8m CPU product in order to conduct a CFD thermal simulation survey.
I have found similar information for the imx6 processor (AN4579) which gives an excellent detailed breakdown of the thermal conductivities attached to each section of the device but cannot find an equivalent for the imx8. Of course, the device is in an enclosed package so I cannot easily identify the size of the die and interface, there may be a need to specify dimensions for this product version also.
Alternatively, information in the format of a 2-resistor model (junction-to-case and junction-to-board resistance) would be acceptable. Please note that junction-to-ambient is not usable.
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Thank You,
Boris
We have no specific thermal guideline document for i.MX8M series.
However, as the basic concept, i.MX6 application note is applicable to i.MX8M as well.