For today's blog, I am going to keep it short and direct it to the PCB layout engineers out there. The i.MX RT1010 MCU designers want you to know that the utmost care was taken when designing the i.MX RT1010 device. Even if your company typically prioritizes product requirements over package requirements, NXP has you covered. During our package development, we do a number of pin-out iterations and a fanout exercise to make sure that the i.MX RT LQFP packages are easily laid out for 2-layer through-hole PCBs. We make sure that your PCB design will not require buried or blind vias, that you will be able to support at least 4 mil PCB traces and spaces on your board and that you will be able to avoid all high-density PCB design rules. How do we do that? By designing our own EVK boards in-house and then passing along our knowledge. It’s not every day that you can find a 500 MHz device in a small, easy-to-lay-out 80LQFP package. i.MX RT1010 is the MCU where both your product requirements and your package requirements meet.