T4241 - Maximum allowed mechanical pressure on BGA

[m_raninec]

Hello,

I have been experiencing some solder joint fractures on a board with T4241. I want to do an analysis to check if the thermal interface material we use exerts excessive mechanical pressure on the BGA when compressed.

What is the maximum initial (one-time) and sustained mechanical pressure that can be applied on the BGA? I found in the datasheet that the spring force (if using spring attached heatsink) should not exceed 270N, but is this the initial load value, or the sustained load?

Thanks,

Michal

[yipingwang]

Please refer to the following update from the AE team.

I checked with the packaging team and they informed me that the 270N is sustained load. We do not specify initial one-time load.