Hey, Tomas!
I'm having the same issue with the barometers.
On one product I get 1 or 2 failures in a batch of 125, but on another I got 20 failures in a batch of 125. This has been going on since we switched to the MPL3115A2.
We've been through all of the rounds with the assembly house, and have seen the boards being processed. We even use leaded solder in our products, so the temperature peak is much lower than for unleaded. I've written firmware to use the on board I2C hardware of the uC, as well as some slow bit banging code. Always a high failure rate.
I've read all of the comments I can find and this is the only other person to admit to a high failure rate.
We have measured failed units at various altitudes with a vacuum pump and have noticed each failed unit appears to have gotten a fixed offset that tracks as it is brought to different altitudes.
We sent back many units to NXP when this first started and they said we had junk in our sensors. I took several new sensors from inventory and took photos with our microscope. Many had some junk in them. They appear as strands of possibly the same material you are using to coat the die. The failures have occurred with parts from several batch numbers.
The MPL3115A2 seems great for our application, but not at these failure rates.
Help!
Tom