S32G2 Thermals: Customer looking for θ_jc rather than the Ψ_jt

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S32G2 Thermals: Customer looking for θ_jc rather than the Ψ_jt

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markdouglas
NXP Employee
NXP Employee

In our S32G2 data sheet we provide:

markdouglas_2-1622148460564.png

and

markdouglas_3-1622148485726.png

What they are looking for is θ_jc ( which is the Thermal Resistance Junction-to-Case ) rather than the Ψ_jt ( which is Junction-to-Top (of Package) Characterization Parameter ) that is the second row of Table 6 of your referenced datasheet.

Where can I find the θ_jc ( which is the Thermal Resistance Junction-to-Case )?

Thanks,

Mark D.

 

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markdouglas
NXP Employee
NXP Employee

Rating

Board Type2

Symbol

Value

Unit

Junction to Ambient Thermal Resistance1

JESD51-9, 2s2p

RθJA

16.5

°C/W

Junction-to-Top of Package Thermal Characterization Parameter1

JESD51-9, 2s2p

YJT

0.1

°C/W

Junction to Case Thermal Resistance3

N/A

RθJC

0.65

°C/W

 

Foot Note:

  1. Determined in accordance with JEDEC JESD51-2A natural convection environment. Thermal resistance data in this report is solely for a thermal performance comparison of one package to another in a standardized specified environment. It is not meant to predict the performance of a package in an application-specific environment
  1. Thermal test board meets JEDEC specification for this package (JESD51-9).
  2. Junction-to-Case thermal resistance determined using an isothermal cold plate. Case temperature refers to the lid surface temperature.

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295 Views
markdouglas
NXP Employee
NXP Employee

Rating

Board Type2

Symbol

Value

Unit

Junction to Ambient Thermal Resistance1

JESD51-9, 2s2p

RθJA

16.5

°C/W

Junction-to-Top of Package Thermal Characterization Parameter1

JESD51-9, 2s2p

YJT

0.1

°C/W

Junction to Case Thermal Resistance3

N/A

RθJC

0.65

°C/W

 

Foot Note:

  1. Determined in accordance with JEDEC JESD51-2A natural convection environment. Thermal resistance data in this report is solely for a thermal performance comparison of one package to another in a standardized specified environment. It is not meant to predict the performance of a package in an application-specific environment
  1. Thermal test board meets JEDEC specification for this package (JESD51-9).
  2. Junction-to-Case thermal resistance determined using an isothermal cold plate. Case temperature refers to the lid surface temperature.

View solution in original post

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