In our S32G2 data sheet we provide:
and
What they are looking for is θ_jc ( which is the Thermal Resistance Junction-to-Case ) rather than the Ψ_jt ( which is Junction-to-Top (of Package) Characterization Parameter ) that is the second row of Table 6 of your referenced datasheet.
Where can I find the θ_jc ( which is the Thermal Resistance Junction-to-Case )?
Thanks,
Mark D.
Solved! Go to Solution.
Rating |
Board Type2 |
Symbol |
Value |
Unit |
Junction to Ambient Thermal Resistance1 |
JESD51-9, 2s2p |
RθJA |
16.5 |
°C/W |
Junction-to-Top of Package Thermal Characterization Parameter1 |
JESD51-9, 2s2p |
YJT |
0.1 |
°C/W |
Junction to Case Thermal Resistance3 |
N/A |
RθJC |
0.65 |
°C/W |
Foot Note:
Rating |
Board Type2 |
Symbol |
Value |
Unit |
Junction to Ambient Thermal Resistance1 |
JESD51-9, 2s2p |
RθJA |
16.5 |
°C/W |
Junction-to-Top of Package Thermal Characterization Parameter1 |
JESD51-9, 2s2p |
YJT |
0.1 |
°C/W |
Junction to Case Thermal Resistance3 |
N/A |
RθJC |
0.65 |
°C/W |
Foot Note: