MC9S12XDP512MAG Chip problem analysis - Bond crater damage

[join_ren]

Dear NXP:

At present, some NXP MC9S12XDP512MAG chips have encountered bonding crater damage problems during third-party laboratory analysis. The following are the test results and related analysis pictures. We have learned from many sources that this bond crater damage problem generally comes from the chip production process and cannot be avoided. In this regard, we would like to know what is the current control standard of NXP for the factory qualification inspection of this bonded crater damage problem, such as the size of the bonded crater, the number can meet the qualification requirements and so on? So that our customers can make further technical evaluation.

[nirmalbishnoi]

Dear @join_ren ,

The NXP MC9S12XDP512MAG chips are manufactured under strict quality control standards. The bonding crater damage problem you mentioned is indeed a concern that can occur during the chip production process, but it is not unavoidable. NXP has stringent control standards in place to minimize such issues.

The exact specifications for bonding crater size and acceptable number can vary depending on the specific product and its application. However, NXP generally adheres to the JEDEC standards for semiconductor manufacturing, which provide guidelines for acceptable crater sizes and numbers. These standards are internationally recognized and widely used in the semiconductor industry.

For the MC9S12XDP512MAG chips, the factory qualification inspection includes rigorous testing to ensure that the chips meet the required standards. This includes visual inspection, electrical testing, and reliability testing. The chips are also subjected to environmental stress tests to ensure their performance under various conditions.

For more specific information about the control standards for the MC9S12XDP512MAG chips, I would recommend referring to the product data-sheet and the quality and reliability information available on the NXP website. These documents provide detailed information about the product specifications and the quality control measures in place.

If you have further questions or need more detailed information, please feel free to ask. We are here to help.

[join_ren]

Dear nirmalbishnoi：

• What are the specific JEDEC standards regarding guidelines for acceptable crater sizes and numbers as we are not familiar with the standards.
• What are the specific quality and reliability documents on the NXP website regarding the control standards of MC9S12XDP512MAG chips for the bonding crater damage issue?

Thanks for your support.